General
| Property | Temperature | Value | Comment |
|---|---|---|---|
Absorción de agua | 23.0 °C | 0.21 % Show Material materials with Absorción de agua of 0.21 % | ISO 62 (50% RH, 24h) |
Densidad | 23.0 °C | 1.26 g/cm³ Show Material materials with Densidad of 1.26 g/cm³ | ISO 1183 |
Medidas
| Property | Value |
|---|---|
Espesor | 0.05 mm Show Material materials with Espesor of 0.05 mm |
Mecánica
| Property | Temperature | Value | Comment |
|---|---|---|---|
Elongación | 23.0 °C | 200 % Show Material materials with Elongación of 200 % | ISO 527 |
Elongación transversal | 23.0 °C | 200 % Show Material materials with Elongación transversal of 200 % | ISO 527 |
Módulo elástico | 23.0 °C | 1.8 GPa Show Material materials with Módulo elástico of 1.8 GPa | ISO 527 |
Módulo elástico transversal | 23.0 °C | 1.8 GPa Show Material materials with Módulo elástico transversal of 1.8 GPa | ISO 527 |
Resistencia a desgarros | 23.0 °C | 6 kN/m Show Material materials with Resistencia a desgarros of 6 kN/m | ISO 6383-1 |
Resistencia a desgarros transversal | 23.0 °C | 6 kN/m Show Material materials with Resistencia a desgarros transversal of 6 kN/m | ISO 6383-1 |
Resistencia a la perforación | 23.0 °C | 470 kJ/m² Show Material materials with Resistencia a la perforación of 470 kJ/m² | Def Stan 81-75 |
Resistencia a la tracción | 23.0 °C | 120 MPa Show Material materials with Resistencia a la tracción of 120 MPa | ISO 527 |
Resistencia a la tracción transversal | 23.0 °C | 120 MPa Show Material materials with Resistencia a la tracción transversal of 120 MPa | ISO 527 |
Aplicaciones térmicas
Eléctrico
| Property | Temperature | Value | Comment |
|---|---|---|---|
Constante dieléctrica | 23.0 °C | 3 [-] Show Material materials with Constante dieléctrica of 3 [-] | ASTM D150 (10MHz) |
Resistividad eléctrica | 23.0 °C | 2.00E+14 Ω·m Show Material materials with Resistividad eléctrica of 2.00E+14 Ω·m | ASTM D257 (100V) |
Rigidez dieléctrica | 23.0 °C | 190 kV/mm Show Material materials with Rigidez dieléctrica of 190 kV/mm | ASTM D149 (6.25mm electrode) |
Tangente de pérdidas | 23.0 °C | 3E-3 [-] Show Material materials with Tangente de pérdidas of 3E-3 [-] | ASTM D150 (10Mhz) |
Tensión de ruptura | 23.0 °C | 9.5 kV Show Material materials with Tensión de ruptura of 9.5 kV | ASTM D149 (6.25mm electrode) |
Rheological Properties
Technological properties
| Property | ||
|---|---|---|
| Application areas | Aerospace insulation, electrical insulation, acoustic speaker diaphragms, thermoforming of thin wall parts, composites | |
| Certifications | APTIV 2000 film is approved for Food Contact Use: APTIV 2000 film is compliant with the compositional requirements of FDA 21 CFR 177.2415. APTIV 2000 film is compliant with the framework regulation (EC) No. 1935/2004/EC and commission directive 2002/72/EC and the amendments up to 2005/79/EC. APTIV 2000 film is fully compliant with the 3-A Sanitary Standards. APTIV film 2000 complies with the requirements of RoHS European Directive 2002/95/EC and can be used to manufacture products compliant with the same directive. APTIV 2000 film is inherently halogen-free in accordance with IEC61249-2-21. | |
| Other | The key features are: High heat resistance, excellent Flexural fatigue properties, broad chemical resistance, low moisture absorption, high strength and toughness, stable and excellent electrical insulation properties, good flammability performance without use of flame retardant additives, inherently halogen-free, radiation resistance, low smoke and toxic gas emission, excellent hydrolysis resistance, excellent acoustic properties, high purity, lightweight, recyclable, easy to process. | |
| Processing methods | Can be laminated to other materials thermoformed, metallised, coated, printed, stamped and die cut, welded and heat sealed and coated. APTIV 2000 film can easily be subjected to a range of secondary process operations, which allow designers and engineers to obtain the benefits of APTIV film properties in a variety of forms: Surface treatment, adhesion, coatings, slitting, die cutting and stamping, thermal lamination, heat welding and heat sealing, metallisation, laser marking and machining, thermoforming, printing | |