EN 1652 Grade Cu-DLP R360

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Description

Cu-DLP, mat. No CW023A, is a deoxidized copper with limited, low residual copper-content. To the comparable DIN-make SW-Cu, mat. No 2.0076 acc. to DIN 1787 : 1973-01 applies: Tensile strength and Brinell hardness are increasable by cold forming. SW-Cu is hydrogen resistant and shows the lowest thermal and electrical conductivity of the pure copper materials. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: very good soft soldering: very good gas-shielded welding: good burnishing: very good Application: Preferably in apparatus engineering and construction trade. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)

Related Standards

Equivalent Materials

Los datos sobre este material han sido proporcionados por WIAM.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

Property	Temperature	Value
Densidad	20.0 °C	8.9 - 8.94 g/cm³ Show Material materials with Densidad of 8.9 - 8.94 g/cm³

Mecánica

Property	Temperature	Value	Comment
Coeficiente de Poisson	20.0 °C	0.34 [-] Show Material materials with Coeficiente de Poisson of 0.34 [-]
Elongación A50	20.0 °C	2 % Show Material materials with Elongación A50 of 2 %
Límite elástico Rp 0,2	20.0 °C	320 MPa Show Material materials with Límite elástico Rp 0,2 of 320 MPa
Módulo de cizallamiento	23.0 °C	48 GPa Show Material materials with Módulo de cizallamiento of 48 GPa	Typical for Wrought Copper Pure / Low Alloyed Copper
Módulo elástico	20.0 °C	129 - 132 GPa Show Material materials with Módulo elástico of 129 - 132 GPa
Resistencia a la tracción	20.0 °C	360 MPa Show Material materials with Resistencia a la tracción of 360 MPa

Aplicaciones térmicas

Property	Temperature	Value	Comment
Calor específico	20.0 °C	385 - 386 J/(kg·K) Show Material materials with Calor específico of 385 - 386 J/(kg·K)
Coeficiente de dilatación térmica	23.0 °C	1.6E-5 - 1.8E-5 1/K Show Material materials with Coeficiente de dilatación térmica of 1.6E-5 - 1.8E-5 1/K	Typical for Wrought Copper Pure / Low Alloyed Copper
Conductividad térmica	20.0 °C	350 - 370 W/(m·K) Show Material materials with Conductividad térmica of 350 - 370 W/(m·K)
Temperatura de fusión		965 - 1100 °C Show Material materials with Temperatura de fusión of 965 - 1100 °C	Typical for Wrought Copper Pure / Low Alloyed Copper

Eléctrico

Property	Temperature	Value
Conductividad eléctrica	20.0 °C	5.20E+7 S/m Show Material materials with Conductividad eléctrica of 5.20E+7 S/m
Resistividad eléctrica	20.0 °C	1.9E-8 Ω·m Show Material materials with Resistividad eléctrica of 1.9E-8 Ω·m
Specific Electrical conductivity		90 % IACS Show Material materials with Specific Electrical conductivity of 90 % IACS

Chemical properties

Property	Value
Bismuto	5E-4 % Show Material materials with Bismuto of 5E-4 %
Cobre	99.9 % Show Material materials with Cobre of 99.9 %
Fósforo	0.01 % Show Material materials with Fósforo of 0.01 %
Plomo	5E-3 % Show Material materials with Plomo of 5E-3 %

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EN 1652 Grade Cu-DLP R360

Description

Related Standards

Equivalent Materials

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Propiedades