EN 12163 Grade Cu-DHP R280

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Description

Cu-DHP, mat. No CW024A, is a phosphoric pure copper grade. To the comparable DIN-mark SF-Cu, mat. No 2.0090 acc. to DIN 1787 applies: The material is a deoxidized copper with Cu >= 99,9% and a high residual copper-content. Tensile strength and Brinell hardness are increasable by cold forming. SF-Cu (Cu-DHP) is hydrogen resistant and shows the lowest thermal and electrical conductivity of the pure copper materials. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: very good soft soldering: very good gas-shielded welding: very good burnishing: very good Application: SF-Cu is the most important copper-grade for pipes due to its very good soldering and welding properties. Further application in apparatus engineering and construction trade. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)

Related Standards

Equivalent Materials

Los datos sobre este material han sido proporcionados por WIAM.

A menos que se indique lo contrario, todas las medidas corresponden a condiciones de temperatura ambiente. A menos que se indique lo contrario, se utilizan las unidades del SI.
Las normas armonizadas son similares a uno o varios estándares del proveedor. Es posible que algunas normas armonizadas se ajusten al estándar original, mientras que otras pueden quedar fuera de su alcance.

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Propiedades

General

PropertyTemperatureValue

Densidad

20.0 °C

8.9 - 8.94 g/cm³

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Mecánica

PropertyTemperatureValueComment

Coeficiente de Poisson

23.0 °C

0.34 [-]

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Typical for Wrought Copper Pure / Low Alloyed Copper

Elongación

20.0 °C

10 %

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Límite elástico Rp 0,2

20.0 °C

220 - 260 MPa

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Módulo de cizallamiento

23.0 °C

48 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper

Módulo elástico

23.0 °C

95 - 98 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper

Resistencia a la tracción

20.0 °C

280 MPa

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Aplicaciones térmicas

PropertyTemperatureValueComment

Calor específico

-150.0 °C

282 J/(kg·K)

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-50.0 °C

361 J/(kg·K)

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20.0 °C

386 J/(kg·K)

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100.0 °C

393 J/(kg·K)

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200.0 °C

403 J/(kg·K)

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300.0 °C

415 J/(kg·K)

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Coeficiente de dilatación térmica

100.0 °C

1.68E-5 1/K

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200.0 °C

1.73E-5 1/K

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300.0 °C

1.77E-5 1/K

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Conductividad térmica

20.0 °C

305 W/(m·K)

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50.0 °C

310 W/(m·K)

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100.0 °C

318 W/(m·K)

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200.0 °C

326 W/(m·K)

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300.0 °C

334 W/(m·K)

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Temperatura de fusión

965 - 1100 °C

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Typical for Wrought Copper Pure / Low Alloyed Copper

Eléctrico

PropertyTemperatureValue

Conductividad eléctrica

20.0 °C

4.30E+7 S/m

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50.0 °C

4.10E+7 S/m

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100.0 °C

3.70E+7 S/m

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200.0 °C

3.40E+7 S/m

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300.0 °C

3.00E+7 S/m

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Resistividad eléctrica

20.0 °C

2.2E-8 Ω·m

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50.0 °C

2.4E-8 Ω·m

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100.0 °C

2.7E-8 Ω·m

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200.0 °C

2.9E-8 Ω·m

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300.0 °C

3.3E-8 Ω·m

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Chemical properties

PropertyValue

Cobre

99.9 %

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Fósforo

0.02 - 0.04 %

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