Aluminium Nitride (B)

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Aluminium Nitride has the following features:

  • High thermal conductivity combined with good electrical insulation characteristics.
  • Exceptional stability when exposed to many molten salts.
  • Thermal stability up to at least 1500°C
  • Favorable mechanical characteristics extending into the high temperature range.
  • Low thermal expansion and resistance to thermal shock.
  • Special optical and acoustic characteristics.
  • This material data has been provided by Innovacera.

    "Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
    All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
    Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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    23.0 °C

    3.3 g/cm³

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    Compressive strength

    23.0 °C

    2500 MPa

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    Elastic modulus

    23.0 °C

    320 GPa

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    Flexural strength

    23.0 °C

    325 MPa

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    Hardness, Vickers

    23.0 °C

    1020 [-]

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    Poisson's ratio

    23.0 °C

    0.24 [-]

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    Coefficient of thermal expansion

    23.0 °C

    4.6E-6 1/K

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    Specific heat capacity

    23.0 °C

    740 J/(kg·K)

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    Thermal conductivity

    23.0 °C

    190 W/(m·K)

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    Dielectric constant

    23.0 °C

    8.56 [-]

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    Dielectric strength

    23.0 °C

    15 kV/mm

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    Electrical resistivity

    23.0 °C

    1.00E+16 Ω·m

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    Loss tangent

    23.0 °C

    2.8E-4 [-]

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    Technological properties

    Application areas

    Aluminum Nitride Ceramics is ideal for applications where heat dissipation is required. In addition, since it offers a coefficient of thermal expansion (CTE) near that of silicon, and excellent plasma resistance, it is used for: Semiconductor processing equipment components, Ceramic Heat-sinks for high power system, Crucible for Metal Melting, Ceramic Rod, Ceramic Heater, Ceramic Substrate

    Processing methods

    Ceramic Injection Molding, Low Pressure Injection Molding, Cold Isostatic Press, Dry Press, Tape Casting, Precision Machining Processing