2.8 - 2.9 g/cm³
Show Supplier Material materials with Density of 2.8 - 2.9 g/cm³
Show Supplier Material materials with Electrical resistivity of 1.00E+14 Ω·m
Thermal Management: very useful as a heat sink in high power electronic applications and electronic packaging materials. High Temperature Environments: equipment for plasma arc welding, diffusion source wafers, and semiconductor crystal growth equipment & processing. Molten Metal Handling: ideal for interface materials used in various molten metal processes.
Hot Pressed Sintering, Chemical Vapor Deposition