General
Property | Temperature | Value | |
---|---|---|---|
Density | 23.0 °C | 2.4 - 2.5 g/cm³ Show Supplier Material materials with Density of 2.4 - 2.5 g/cm³ | |
Binder | B₂O₃ |
Mechanical
Thermal
Property | Temperature | Value |
---|---|---|
Coefficient of thermal expansion | 23.0 °C | 2.8E-6 1/K Show Supplier Material materials with Coefficient of thermal expansion of 2.8E-6 1/K |
Thermal conductivity | 23.0 °C | 45 W/(m·K) Show Supplier Material materials with Thermal conductivity of 45 W/(m·K) |
Electrical
Property | Temperature | Value |
---|---|---|
Electrical resistivity | 23.0 °C | 1.00E+14 Ω·m Show Supplier Material materials with Electrical resistivity of 1.00E+14 Ω·m |
Technological properties
Property | ||
---|---|---|
Application areas | Thermal Management: very useful as a heat sink in high power electronic applications and electronic packaging materials. High Temperature Environments: equipment for plasma arc welding, diffusion source wafers, and semiconductor crystal growth equipment & processing. Molten Metal Handling: ideal for interface materials used in various molten metal processes. | |
Processing methods | Hot Pressed Sintering, Chemical Vapor Deposition |