Alumina+Zirconia+Boron Nitride

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Description

Hexagonal Boron Nitride has a microstructure similar to that of Graphite. In both materials this structure, made up of layers of tiny platelets, is responsible for excellent machinability and low-friction properties. we called hexagonal boron nitride (HBN) or white graphite.

This material data has been provided by Innovacera.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts

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Properties

General

Property	Temperature	Value
Density	23.0 °C	2.25 - 2.35 g/cm³ Show Supplier Material materials with Density of 2.25 - 2.35 g/cm³
Binder	AlBO₃

Mechanical

Property	Temperature	Value
Compressive strength	23.0 °C	145 MPa Show Supplier Material materials with Compressive strength of 145 MPa
Flexural strength	23.0 °C	65 MPa Show Supplier Material materials with Flexural strength of 65 MPa

Thermal

Property	Temperature	Value
Coefficient of thermal expansion	23.0 °C	2E-6 1/K Show Supplier Material materials with Coefficient of thermal expansion of 2E-6 1/K
Thermal conductivity	23.0 °C	35 W/(m·K) Show Supplier Material materials with Thermal conductivity of 35 W/(m·K)

Electrical

Property	Temperature	Value
Electrical resistivity	23.0 °C	1.00E+15 Ω·m Show Supplier Material materials with Electrical resistivity of 1.00E+15 Ω·m

Technological properties

Property
Application areas	Thermal Management: very useful as a heat sink in high power electronic applications and electronic packaging materials. High Temperature Environments: equipment for plasma arc welding, diffusion source wafers, and semiconductor crystal growth equipment & processing. Molten Metal Handling: ideal for interface materials used in various molten metal processes.
Processing methods	Hot Pressed Sintering, Chemical Vapor Deposition

Alumina+Zirconia+Boron Nitride

Description

Ashby charts

Applications

Materials by this supplier

Use cases

Properties