Pyrolytic Boron Nitride

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Hexagonal Boron Nitride has a microstructure similar to that of Graphite. In both materials this structure, made up of layers of tiny platelets, is responsible for excellent machinability and low-friction properties. we called hexagonal boron nitride (HBN) or white graphite.

This material data has been provided by Innovacera.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts





23.0 °C

2.1 g/cm³

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Thermal conductivity

23.0 °C

2.6 W/(m·K)

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Dielectric constant

23.0 °C

5.81 [-]

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Dielectric strength

23.0 °C

51 kV/mm

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Technological properties

Application areas

Thermal Management: very useful as a heat sink in high power electronic applications and electronic packaging materials. High Temperature Environments: equipment for plasma arc welding, diffusion source wafers, and semiconductor crystal growth equipment & processing. Molten Metal Handling: ideal for interface materials used in various molten metal processes.

Processing methods

Hot Pressed Sintering, Chemical Vapor Deposition