General
| Property | Temperature | Value |
|---|---|---|
Density | 23.0 °C | 7.4 g/cm³ Show Material materials with Density of 7.4 g/cm³ |
Thermal
| Property | Value |
|---|---|
Melting point | 232 °C Show Material materials with Melting point of 232 °C |
Chemical properties
| Property | Value |
|---|---|
Chromium | 2 - 6 % Show Material materials with Chromium of 2 - 6 % |
Copper | 0.01 - 1 % Show Material materials with Copper of 0.01 - 1 % |
Silver | 3 - 5 % Show Material materials with Silver of 3 - 5 % |
Tin | 90 - 100 % Show Material materials with Tin of 90 - 100 % |
Technological properties
| Property | ||
|---|---|---|
| Certifications | RoHS | |
| Other | The key features are: Excellent flow, good wetting of surfaces to be joined, electrically and thermally conductive, aluminium to aluminium can be soldered without using flux, carbon can be soldered to metals (e.g. copper, aluminium), ceramics and glass materials, C-Solder is not affected by cleaning solvents, C-Solder does not leave residues, C-Solder is not flammable, C-Solder is flux free, C-Solder is lead free | |