General Epoxide; Epoxy (EP+GF30+MD20)

Alternative and trade names
Bakelite®
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Description

Epoxy moulding compound, inorganically filled, glass fiber reinforced, heat resistant, dimensionally stable, good electric and mechanical properties, very good chemical resistance and low viscosity.

Properties

General

Density ρ

1.83 - 1.93 g/cm³ at 20 °C

Mechanical

Elastic modulus E

14 - 17 GPa at 20 °C

Elongation A

4 % at 20 °C

Impact strength, Charpy notched Ivnot

3 - 6 kJ/m² at 20 °C

Impact strength, Charpy unnotched Iunnot

7 - 12 kJ/m² at 20 °C

Max allowed stress σmax

50 - 70 MPa at 20 °C

at 4% strain

Thermal

Coefficient of thermal expansion α

2E-5 - 3E-5 1/K at 20 °C

Flammability

UL 94 HB

Max service temperature, long Tmaxlong

170 °C

Max service temperature, short Tmaxshort

210 °C

Thermal conductivity λ

0.6 - 0.8 W/(m·K) at 20 °C

Electrical

Dielectric constant εr

5 - 8 [-] at 20 °C

Electrical resistivity ρel

1.00E+11 - 1.00E+12 Ω·m at 20 °C

Optical

Transparency

no

Technological properties

Application areas

Bobbins, car electronic, reflectors, spark plug connectors

Fillers

25% Glass Fibers and 45% Mineral Powder

Processing methods

Injection molding, compression molding, transfer molding

This material data has been provided by M-Base.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.