Epoxide; Epoxy Reinforced with 30% Glass Fibers and 20% Mineral Powder (EP+GF25+MD45)

Alternative and trade names
Bakelite®
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Description

Epoxy moulding compound, inorganically filled, glass fiber reinforced, highly heat resistant, good electrical properties, even at higher temperatures, very slight post shrinkage, increased media resistance

Properties

General

Density ρ

1.84 - 1.9 g/cm³ at 20 °C

Mechanical

Elastic modulus E

15 - 17 GPa at 20 °C

Elongation A

4 % at 20 °C

Impact strength, Charpy notched Ivnot

5 - 9 kJ/m² at 20 °C

Impact strength, Charpy unnotched Iunnot

9 - 14 kJ/m² at 20 °C

Max allowed stress σmax

70 - 90 MPa at 20 °C

at 4% strain

Thermal

Coefficient of thermal expansion α

2E-5 - 3E-5 1/K at 20 °C

Flammability

UL 94 V1-V0

Max service temperature, long Tmaxlong

170 °C

Max service temperature, short Tmaxshort

210 °C

Thermal conductivity λ

0.6 - 0.8 W/(m·K) at 20 °C

Electrical

Dielectric constant εr

3.5 - 6.5 [-] at 20 °C

Electrical resistivity ρel

1.00E+11 - 1.00E+12 Ω·m at 20 °C

Optical

Transparency

no

Technological properties

Application areas

Spark plug connectors, contact strips, contact bridges

Fillers

30% Glass Fiber and 20% Mineral Powder

Processing methods

Injection molding, compression molding

This material data has been provided by M-Base.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.