DIN 17745 Grade NiFe47

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Description

The expansion material NiFe47 is to a large extent applied for glass sealings in soft glasses. It possesses a relatively low thermal expansion up to approximately 450 °C. (Temperature interval RT to 400 °C: coefficient of thermal expansion 9.7 to 10.5 10^-6 K^-1). The alloy is of relative durability at normal temperatures in air with normal weather conditions as well as in fresh water and sea water. NiFe47 is well weldable by using the tungsten inert-gas method.

Related Standards

This material data has been provided by WIAM.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.2 g/cm³

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Mechanical

PropertyTemperatureValue

Elastic modulus

20.0 °C

160 GPa

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Elongation

20.0 °C

3 - 30 %

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Hardness, Brinell

20.0 °C

135 - 250 [-]

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Tensile strength

20.0 °C

540 - 820 MPa

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Yield strength Rp0.2

20.0 °C

240 - 810 MPa

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Thermal

PropertyTemperatureValue

Coefficient of thermal expansion

100.0 °C

1.03E-5 1/K

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200.0 °C

1.02E-5 1/K

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300.0 °C

1.01E-5 1/K

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400.0 °C

9.9E-6 1/K

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500.0 °C

1E-5 1/K

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600.0 °C

1.09E-5 1/K

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Specific heat capacity

20.0 °C

500 J/(kg·K)

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Thermal conductivity

20.0 °C

16.8 W/(m·K)

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Electrical

PropertyTemperatureValue

Electrical resistivity

20.0 °C

4.4E-7 Ω·m

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Chemical properties

PropertyValue

Carbon

0.02 %

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Iron

47 - 50 %

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Manganese

0.6 %

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Nickel

49.08 %

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Silicon

0.3 %

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