AuAg32Cu5.5 soft annealed (+A)

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Description

The gold-silver-copper material AuAg32Cu5.5, also Au62.5Ag32Cu5.5 or 62.5Au32Ag5.5Cu, is used for electrical contacts.

Related Standards

This material data has been provided by WIAM.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

20.0 °C

14.3 g/cm³

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Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

74 - 81 GPa

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Typical for Gold

Hardness, Vickers

20.0 °C

90 [-]

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Poisson's ratio

23.0 °C

0.42 [-]

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Typical for Gold

Shear modulus

23.0 °C

26 GPa

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Typical for Gold

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.4E-5 1/K

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Typical for Gold

Melting point

1064 °C

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Typical for Gold

Specific heat capacity

23.0 °C

126 - 138 J/(kg·K)

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Typical for Gold

Thermal conductivity

20.0 °C

54 W/(m·K)

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Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

8.00E+6 S/m

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Electrical resistivity

20.0 °C

1.25E-7 Ω·m

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Chemical properties

PropertyValue

Copper

5.5 %

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Gold

62.5 %

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Silver

32 %

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