Das Material: 'Hot Isotactic Pressed Boron Nitride >99.0% Purity', nach dem Sie gesucht haben, wurde durch das untenstehende ersetzt.
Eigenschaften
Allgemein
| Property | Temperature | Value | |
|---|---|---|---|
Dichte | 23.0 °C | 2 g/cm³ Show Supplier Material materials with Dichte of 2 g/cm³ | |
Binder | B₂O₃ | ||
Mechanisch
Thermisch
| Property | Temperature | Value |
|---|---|---|
Koeffizient der thermischen Ausdehnung | 23.0 °C | 1.8E-6 1/K Show Supplier Material materials with Koeffizient der thermischen Ausdehnung of 1.8E-6 1/K |
Wärmeleitfähigkeit | 23.0 °C | 40 W/(m·K) Show Supplier Material materials with Wärmeleitfähigkeit of 40 W/(m·K) |
Elektrisch
| Property | Temperature | Value |
|---|---|---|
spezifischer Widerstand | 23.0 °C | 1.00E+16 Ω·m Show Supplier Material materials with spezifischer Widerstand of 1.00E+16 Ω·m |
Technological properties
| Property | ||
|---|---|---|
| Application areas | Thermal Management: very useful as a heat sink in high power electronic applications and electronic packaging materials. High Temperature Environments: equipment for plasma arc welding, diffusion source wafers, and semiconductor crystal growth equipment & processing. Molten Metal Handling: ideal for interface materials used in various molten metal processes. | |
| Processing methods | Hot Pressed Sintering, Chemical Vapor Deposition | |