Eigenschaften
Allgemein
| Property | Temperature | Value |
|---|---|---|
Dichte | 23.0 °C | 2.85 g/cm³ Show Supplier Material materials with Dichte of 2.85 g/cm³ |
Mechanisch
| Property | Temperature | Value |
|---|---|---|
Biegefestigkeit | 23.0 °C | 190 MPa Show Supplier Material materials with Biegefestigkeit of 190 MPa |
Thermisch
| Property | Temperature | Value | |
|---|---|---|---|
Koeffizient der thermischen Ausdehnung | 23.0 °C | 7E-6 - 8.5E-6 1/K Show Supplier Material materials with Koeffizient der thermischen Ausdehnung of 7E-6 - 8.5E-6 1/K | |
Wärmeleitfähigkeit | 23.0 °C | 240 W/(m·K) Show Supplier Material materials with Wärmeleitfähigkeit of 240 W/(m·K) | |
Temperaturschockparameter R2 | 0-800°C no cracking phenomenon | ||
Elektrisch
| Property | Temperature | Value |
|---|---|---|
Dielektrizitätskonstante | 23.0 °C | 6.9 [-] Show Supplier Material materials with Dielektrizitätskonstante of 6.9 [-] |
Verlustfaktor | 23.0 °C | 4E-4 [-] Show Supplier Material materials with Verlustfaktor of 4E-4 [-] |
spezifischer Widerstand | 23.0 °C | 1.00E+16 Ω·m Show Supplier Material materials with spezifischer Widerstand of 1.00E+16 Ω·m |
Technological properties
| Property | ||
|---|---|---|
| Application areas | Medical: Gas lasers for DNA and tissue analysis, Confocal and wide field fluorescence microscopy equipment, Portable defibrillators, Telecom Infrastructure, Transistors and terminations in the wireless system - Lasers: High end laser diodes for commercial systems, Industrial laser metal cutting and marking equipment, Long range fiber optic transmission - Semiconductor handling equipment: End-effectors and arm components, Wafer chucks, Crucibles for high temperature melting - Energy: Oil and gas exploration, In situ X-ray analysis for down-hole drilling, Concentrating photovoltaic (CPV) systems Optoelectronics, Transmitters, receivers, modulators, and switches, Power amplifiers and drivers - Military and Aerospace: Radar modules, Guidance modules, Microwave and millimeter-wave communications modules - Wireless Communications: Point-to-point and point-to-multipoint radios, Satellite communication modules | |
| Processing methods | Cold Isostatic Press, Dry Press, Tape Casting ,Precision Machining Processing | |