Allgemein
Property | Temperature | Value |
---|---|---|
Dichte | 23.0 °C | 2.1 g/cm³ Show Supplier Material materials with Dichte of 2.1 g/cm³ |
Thermisch
Property | Temperature | Value |
---|---|---|
Wärmeleitfähigkeit | 23.0 °C | 2.6 W/(m·K) Show Supplier Material materials with Wärmeleitfähigkeit of 2.6 W/(m·K) |
Elektrisch
Technological properties
Property | ||
---|---|---|
Application areas | Thermal Management: very useful as a heat sink in high power electronic applications and electronic packaging materials. High Temperature Environments: equipment for plasma arc welding, diffusion source wafers, and semiconductor crystal growth equipment & processing. Molten Metal Handling: ideal for interface materials used in various molten metal processes. | |
Processing methods | Hot Pressed Sintering, Chemical Vapor Deposition |