DIN 1733-1 Grade 2.1363

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Related Standards

Equivalent Materials

This material data has been provided by AluKey.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

23.0 °C

8.9 g/cm³

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Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

110 - 130 GPa

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Typical for Wrought Copper High Copper Alloy

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.6E-5 - 1.8E-5 1/K

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Typical for Wrought Copper High Copper Alloy

Melting point

1000 - 1050 °C

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Specific heat capacity

23.0 °C

360 - 420 J/(kg·K)

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Typical for Wrought Copper High Copper Alloy

Thermal conductivity

23.0 °C

120 - 145 W/(m·K)

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Electrical

PropertyTemperatureValue

Electrical conductivity

23.0 °C

1.50E+7 - 2.00E+7 S/m

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Chemical properties

PropertyValue

Arsenic

0.05 %

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Copper

95 %

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Iron

0.2 %

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Lead

0.01 %

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Manganese

1 - 2 %

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Nickel

0.3 %

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Other

total 0.5

Phosphorus

0.02 %

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Silicon

0.8 %

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Tin

1 %

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