CEN/TS 13388 Grade CW016A M

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Related Standards

Equivalent Materials

This material data has been provided by AluKey.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

8.9 g/cm³

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Typical for Wrought Copper Pure / Low Alloyed Copper

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

126.5 GPa

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Elongation

23.0 °C

30 %

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Poisson's ratio

23.0 °C

0.34 [-]

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Typical for Wrought Copper Pure / Low Alloyed Copper

Shear modulus

23.0 °C

48 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

20.0 °C

1.7E-5 1/K

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100.0 °C

1.7E-5 1/K

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Melting point

1082 °C

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Specific heat capacity

23.0 °C

377 - 420 J/(kg·K)

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Typical for Wrought Copper Pure / Low Alloyed Copper

Thermal conductivity

23.0 °C

380 W/(m·K)

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Electrical

PropertyTemperatureValue

Electrical conductivity

23.0 °C

5.40E+7 - 5.70E+7 S/m

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Electrical resistivity

23.0 °C

1.75E-8 - 1.85E-8 Ω·m

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Chemical properties

PropertyValue

Bismuth

5E-4 %

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Other

total 0.0065. excluded Ag, O

Phosphorus

1E-3 - 7E-3 %

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Silver

0.08 - 0.12 %

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