CEN/TS 13388 Grade CW021A M

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Related Standards

Equivalent Materials

This material data has been provided by AluKey.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

23.0 °C

8.9 g/cm³

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Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

110 GPa

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Elongation

23.0 °C

30 %

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Poisson's ratio

23.0 °C

0.34 [-]

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Typical for Wrought Copper Pure / Low Alloyed Copper

Shear modulus

23.0 °C

48 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

20.0 °C

1.77E-5 1/K

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100.0 °C

1.77E-5 1/K

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Melting point

1083 °C

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Specific heat capacity

23.0 °C

377 - 420 J/(kg·K)

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Typical for Wrought Copper Pure / Low Alloyed Copper

Thermal conductivity

23.0 °C

386 W/(m·K)

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Electrical

PropertyTemperatureValue

Electrical conductivity

23.0 °C

5.70E+7 S/m

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Electrical resistivity

23.0 °C

1.75E-8 Ω·m

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Chemical properties

PropertyValue

Bismuth

5E-4 %

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Copper

99.95 %

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Lead

5E-3 %

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Other

total 0.03. excluded Ag, P

Phosphorus

2E-3 - 7E-3 %

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Selenium

2E-4 %

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Technological properties

Property
Brazing

hard brazing : very good, soft brazing: very good

Workability

Cold forming degree between anneals: max. 95 %, general (condition): very good