CEN/TS 13388 Grade CW021A M

View suppliers (11)
Want to keep this datasheet? Save it now in your required format

Related Standards

Equivalent Materials

This material data has been provided by AluKey.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts

See where falls on the material property chart for against in your materials selection and design process. Our Ashby charts are interactive with more technical data upon clicking. Sign up to get access to this premium feature for free.

Properties

General

PropertyTemperatureValue

Density

23.0 °C

8.9 g/cm³

Show Material materials with Density of 8.9 g/cm³

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

110 GPa

Show Material materials with Elastic modulus of 110 GPa

Elongation

23.0 °C

30 %

Show Material materials with Elongation of 30 %

Poisson's ratio

23.0 °C

0.34 [-]

Show Material materials with Poisson's ratio of 0.34 [-]

Typical for Wrought Copper Pure / Low Alloyed Copper

Shear modulus

23.0 °C

48 GPa

Show Material materials with Shear modulus of 48 GPa

Typical for Wrought Copper Pure / Low Alloyed Copper

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

20.0 °C

1.77E-5 1/K

Show Material materials with Coefficient of thermal expansion of 1.77E-5 1/K

100.0 °C

1.77E-5 1/K

Show Material materials with Coefficient of thermal expansion of 1.77E-5 1/K

Melting point

1083 °C

Show Material materials with Melting point of 1083 °C

Specific heat capacity

23.0 °C

377 - 420 J/(kg·K)

Show Material materials with Specific heat capacity of 377 - 420 J/(kg·K)

Typical for Wrought Copper Pure / Low Alloyed Copper

Thermal conductivity

23.0 °C

386 W/(m·K)

Show Material materials with Thermal conductivity of 386 W/(m·K)

Electrical

PropertyTemperatureValue

Electrical conductivity

23.0 °C

5.70E+7 S/m

Show Material materials with Electrical conductivity of 5.70E+7 S/m

Electrical resistivity

23.0 °C

1.75E-8 Ω·m

Show Material materials with Electrical resistivity of 1.75E-8 Ω·m

Chemical properties

PropertyValue

Bismuth

5E-4 %

Show Material materials with Bismuth of 5E-4 %

Copper

99.95 %

Show Material materials with Copper of 99.95 %

Lead

5E-3 %

Show Material materials with Lead of 5E-3 %

Other

total 0.03. excluded Ag, P

Phosphorus

2E-3 - 7E-3 %

Show Material materials with Phosphorus of 2E-3 - 7E-3 %

Selenium

2E-4 %

Show Material materials with Selenium of 2E-4 %

Technological properties

Property
Brazing

hard brazing : very good, soft brazing: very good

Workability

Cold forming degree between anneals: max. 95 %, general (condition): very good