General
Property | Temperature | Value |
---|---|---|
Density | 23.0 °C | 8.9 g/cm³ Show Material materials with Density of 8.9 g/cm³ |
Mechanical
Property | Temperature | Value | Comment |
---|---|---|---|
Elastic modulus | 23.0 °C | 110 GPa Show Material materials with Elastic modulus of 110 GPa | |
Elongation | 23.0 °C | 30 % Show Material materials with Elongation of 30 % | |
Poisson's ratio | 23.0 °C | 0.34 [-] Show Material materials with Poisson's ratio of 0.34 [-] | Typical for Wrought Copper Pure / Low Alloyed Copper |
Shear modulus | 23.0 °C | 48 GPa Show Material materials with Shear modulus of 48 GPa | Typical for Wrought Copper Pure / Low Alloyed Copper |
Thermal
Property | Temperature | Value | Comment |
---|---|---|---|
Coefficient of thermal expansion | 20.0 °C | 1.77E-5 1/K Show Material materials with Coefficient of thermal expansion of 1.77E-5 1/K | |
100.0 °C | 1.77E-5 1/K Show Material materials with Coefficient of thermal expansion of 1.77E-5 1/K | ||
Melting point | 1083 °C Show Material materials with Melting point of 1083 °C | ||
Specific heat capacity | 23.0 °C | 377 - 420 J/(kg·K) Show Material materials with Specific heat capacity of 377 - 420 J/(kg·K) | Typical for Wrought Copper Pure / Low Alloyed Copper |
Thermal conductivity | 23.0 °C | 386 W/(m·K) Show Material materials with Thermal conductivity of 386 W/(m·K) |
Electrical
Property | Temperature | Value |
---|---|---|
Electrical conductivity | 23.0 °C | 5.70E+7 S/m Show Material materials with Electrical conductivity of 5.70E+7 S/m |
Electrical resistivity | 23.0 °C | 1.75E-8 Ω·m Show Material materials with Electrical resistivity of 1.75E-8 Ω·m |
Chemical properties
Property | Value |
---|---|
Bismuth | 5E-4 % Show Material materials with Bismuth of 5E-4 % |
Copper | 99.95 % Show Material materials with Copper of 99.95 % |
Lead | 5E-3 % Show Material materials with Lead of 5E-3 % |
Other | total 0.03. excluded Ag, P |
Phosphorus | 2E-3 - 7E-3 % Show Material materials with Phosphorus of 2E-3 - 7E-3 % |
Selenium | 2E-4 % Show Material materials with Selenium of 2E-4 % |
Technological properties
Property | ||
---|---|---|
Brazing | hard brazing : very good, soft brazing: very good | |
Workability | Cold forming degree between anneals: max. 95 %, general (condition): very good |