CEN/TS 13388 Grade CW114C R250

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Related Standards

Equivalent Materials

This material data has been provided by AluKey.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

23.0 °C

8.9 g/cm³

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Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

120 GPa

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Elongation

23.0 °C

7 %

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Elongation A100

23.0 °C

3 %

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Hardness, Brinell

23.0 °C

90 [-]

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Hardness, Vickers

23.0 °C

90 [-]

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Poisson's ratio

23.0 °C

0.34 [-]

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Typical for Wrought Copper Pure / Low Alloyed Copper

Shear modulus

23.0 °C

48 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper

Tensile strength

23.0 °C

250 MPa

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Yield strength Rp0.2

23.0 °C

200 MPa

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Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

20.0 °C

1.8E-5 1/K

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100.0 °C

1.8E-5 1/K

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Melting point

1067 - 1079 °C

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Specific heat capacity

23.0 °C

377 - 420 J/(kg·K)

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Typical for Wrought Copper Pure / Low Alloyed Copper

Thermal conductivity

23.0 °C

370 - 375 W/(m·K)

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Electrical

PropertyTemperatureValue

Electrical conductivity

23.0 °C

5.40E+7 - 5.50E+7 S/m

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Electrical resistivity

23.0 °C

1.82E-8 - 1.85E-8 Ω·m

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Chemical properties

PropertyValue

Other

Rest Cu, total 0.1

Phosphorus

0 - 0.01 %

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Sulfur

0.2 - 0.7 %

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Technological properties

Property
Brazing

hard brazing : very good to good, soft brazing: very good

Workability

Cold forming degree between anneals: max. 70 %, general (condition): good