CEN/TS 13388 Grade CW708R R460, H115

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Related Standards

This material data has been provided by AluKey.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.4 g/cm³

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Dimension

PropertyValue

Dimensions

Durchmesser

Mechanical

PropertyTemperatureValue

Elastic modulus

20.0 °C

108 GPa

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Elongation

20.0 °C

12 %

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Hardness, Brinell

20.0 °C

115 - 145 [-]

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Hardness, Vickers

20.0 °C

120 - 150 [-]

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Tensile strength

20.0 °C

460 MPa

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Yield strength Rp0.2

20.0 °C

250 MPa

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Thermal

PropertyTemperatureValue

Coefficient of thermal expansion

20.0 °C

1.92E-5 1/K

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100.0 °C

1.92E-5 1/K

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Melting point

880 - 915 °C

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Thermal conductivity

20.0 °C

71 W/(m·K)

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Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

8.90E+6 S/m

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Electrical resistivity

20.0 °C

1.12E-7 Ω·m

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Chemical properties

PropertyValue

Copper

66 - 70 %

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Iron

0.4 %

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Lead

0.8 %

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Nickel

0.5 %

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Other

Rest Zn, total 0.5

Silicon

0.7 - 1.3 %

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Technological properties

Property
Brazing

hard brazing : medium, soft brazing: medium

Workability

Cold forming degree between anneals: max. 80 %, general (condition): good