Description

Colsibro® is a precipitation hardening copper nickel silicon that offers a remarkable blend of physical and mechanical attributes unrivalled by many other grades of copper alloy. Its combination of high strength, corrosion resistance, high thermal and electrical conductivity, excellent wear resistance, spark resistance and good cryogenic properties has enabled Colsibro® to find a place in virtually every engineering field, from electrical to mechanical and automotive to marine. Colsibro® is a high copper alloy with small additions of nickel and silicon, which combine to increase the strength, hardness and wear resistance of the material, while retaining many of the physical benefits of copper itself.

Equivalent Materials

Properties

General

Density ρ

8.87 g/cm³ at 20 °C

Mechanical

Elongation A

10 % at 20 °C

Hardness, Brinell HB

155 - 180 [-] at 20 °C

Tensile strength Rm

550 - 640 MPa at 20 °C

Yield strength YS

430 - 590 MPa at 20 °C

Thermal

Coefficient of thermal expansion α

1.6E-5 1/K at 20 °C

Melting point Tm

1040 - 1060 °C

Thermal conductivity λ

160 W/(m·K) at 20 °C

Electrical

Electrical conductivity σel

2.03E+7 S/m at 20 °C

Chemical properties

Element

Weight %

Comment

Cu

-

Balance

Ni

1.6 - 2.2 %

Si

0.4 - 0.8 %

This material data has been provided by Columbia Metals.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.