JIS H3270 Grade C7541 H04

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Related Standards

Equivalent Materials

This material data has been provided by Japanese Industrial Standards.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

8.4 - 8.9 g/cm³

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Typical for Wrought Copper Nickel Silver Grade

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

120 - 140 GPa

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Typical for Wrought Copper Nickel Silver Grade

Poisson's ratio

23.0 °C

0.32 [-]

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Typical for Wrought Copper Nickel Silver Grade

Tensile strength

23.0 °C

569 MPa

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Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.6E-5 - 1.9E-5 1/K

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Typical for Wrought Copper Nickel Silver Grade

Melting point

875 - 1135 °C

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Typical for Wrought Copper Nickel Silver Grade

Specific heat capacity

23.0 °C

377 J/(kg·K)

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Typical for Wrought Copper Nickel Silver Grade

Thermal conductivity

23.0 °C

21 - 116 W/(m·K)

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Typical for Wrought Copper Nickel Silver Grade

Technological properties

Property
Processing history

hard