EN 1652 Grade Cu-ETP H090

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Description

Cu-ETP, mat. No CW004A, is an oxygenous copper with Cu >= 99,9%. To the comparable DIN-mark E-Cu58, mat. No 2.0065 acc. to DIN 1787 : 1973-01 applies: The most excellent material property is its high thermal and electrical conductivity. Tensile strength and Brinell hardness are increasable by cold forming. The material does not show any embrittlement at low temperatures and has a high corrosion resistance particularly to drinking and industrial water. It is not hydrogen resistant. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: good soft soldering: very good gas-shielded welding: moderately burnishing: very good Application: Due to the very high conductivity use in electrical engineering, electronics application. Furthermore in food and beverage industry, refrigeration and air-condition technology, in machine, ship, apparatus and vehicle engineering, in household as well as for hardware, in handcraft and in construction trade. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)

Related Standards

Equivalent Materials

This material data has been provided by WIAM.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.9 - 8.94 g/cm³

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Mechanical

PropertyTemperatureValueComment

Elastic modulus

20.0 °C

127 GPa

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Hardness, Brinell

20.0 °C

85 - 105 [-]

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Hardness, Vickers

20.0 °C

90 - 110 [-]

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Poisson's ratio

20.0 °C

0.34 [-]

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Shear modulus

23.0 °C

48 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

100.0 °C

1.68E-5 1/K

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200.0 °C

1.73E-5 1/K

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300.0 °C

1.77E-5 1/K

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Melting point

965 - 1100 °C

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Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

-150.0 °C

282 J/(kg·K)

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-50.0 °C

361 J/(kg·K)

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20.0 °C

386 J/(kg·K)

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Thermal conductivity

-253.0 °C

1298 W/(m·K)

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-200.0 °C

574 W/(m·K)

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-100.0 °C

435 W/(m·K)

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20.0 °C

390 - 394 W/(m·K)

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100.0 °C

385 W/(m·K)

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200.0 °C

381 W/(m·K)

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300.0 °C

377 W/(m·K)

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Chemical properties

PropertyValue

Bismuth

5E-4 %

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Copper

99.9 %

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Lead

5E-3 %

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Oxygen

0.04 %

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