EN 1652 Grade Cu-FRTP R200

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Description

Material Cu-FRTP, mat. No CW006A, is an oxygenous copper-sort of min. 99,90% Cu. It is incomparable to any DIN-mark and it is applicated in the form of plates, sheets, bands, stripes and circular blanks as well as in the form of bars.

Related Standards

Equivalent Materials

This material data has been provided by WIAM.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

8.9 g/cm³

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Typical for Wrought Copper Pure / Low Alloyed Copper

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

95 - 98 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper

Elongation

20.0 °C

42 %

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Poisson's ratio

23.0 °C

0.34 [-]

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Typical for Wrought Copper Pure / Low Alloyed Copper

Shear modulus

23.0 °C

48 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper

Tensile strength

20.0 °C

200 - 250 MPa

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Yield strength Rp0.2

20.0 °C

100 MPa

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Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.6E-5 - 1.8E-5 1/K

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Typical for Wrought Copper Pure / Low Alloyed Copper

Melting point

965 - 1100 °C

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Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

23.0 °C

377 - 420 J/(kg·K)

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Typical for Wrought Copper Pure / Low Alloyed Copper

Chemical properties

PropertyValue

Copper

99.9 %

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Oxygen

0.1 %

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