EN 1652 Grade Cu-OF R220

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Description

The mark Cu-OF, mat. No CW008A, is a copper free of oxygen and deoxidation agents. To the comparable DIN-mark OFCu, mat. No 2.0040 acc. to DIN 1787 : 1973-01 applies: The material is hydrogen resistant and shows very high thermal and electrical conductivity. Tensile strength and Brinell hardness are increasable by cold forming. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: good soft soldering: very good gas-shielded welding: good burnishing: very good Application: Preferred application in electrical engineering, electronics, vacuum technology as well as for production of all types of semifinished parts when highest electrical conductivity is required. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)

Related Standards

Equivalent Materials

This material data has been provided by WIAM.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.9 - 8.94 g/cm³

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Mechanical

PropertyTemperatureValueComment

Elastic modulus

20.0 °C

127 GPa

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Elongation

20.0 °C

42 %

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Elongation A50

20.0 °C

33 %

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Poisson's ratio

20.0 °C

0.34 [-]

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Shear modulus

23.0 °C

48 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper

Tensile strength

20.0 °C

220 - 260 MPa

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Yield strength Rp0.2

20.0 °C

140 MPa

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Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.6E-5 - 1.8E-5 1/K

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Typical for Wrought Copper Pure / Low Alloyed Copper

Melting point

965 - 1100 °C

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Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

20.0 °C

385 J/(kg·K)

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Thermal conductivity

20.0 °C

393 - 394 W/(m·K)

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Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

5.80E+7 S/m

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Electrical resistivity

20.0 °C

1.7E-8 Ω·m

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Chemical properties

PropertyValue

Bismuth

5E-4 %

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Copper

99.95 %

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Lead

5E-3 %

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