EN 1652 Grade Cu-DLP R360

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Cu-DLP, mat. No CW023A, is a deoxidized copper with limited, low residual copper-content. To the comparable DIN-make SW-Cu, mat. No 2.0076 acc. to DIN 1787 : 1973-01 applies: Tensile strength and Brinell hardness are increasable by cold forming. SW-Cu is hydrogen resistant and shows the lowest thermal and electrical conductivity of the pure copper materials. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: very good soft soldering: very good gas-shielded welding: good burnishing: very good Application: Preferably in apparatus engineering and construction trade. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)

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Equivalent Materials

This material data has been provided by WIAM.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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20.0 °C

8.9 - 8.94 g/cm³

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Elastic modulus

20.0 °C

129 - 132 GPa

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Elongation A50

20.0 °C

2 %

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Poisson's ratio

20.0 °C

0.34 [-]

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Shear modulus

23.0 °C

48 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper

Tensile strength

20.0 °C

360 MPa

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Yield strength Rp0.2

20.0 °C

320 MPa

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Coefficient of thermal expansion

23.0 °C

1.6E-5 - 1.8E-5 1/K

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Typical for Wrought Copper Pure / Low Alloyed Copper

Melting point

965 - 1100 °C

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Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

20.0 °C

385 - 386 J/(kg·K)

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Thermal conductivity

20.0 °C

350 - 370 W/(m·K)

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Electrical conductivity

20.0 °C

5.20E+7 S/m

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Electrical resistivity

20.0 °C

1.9E-8 Ω·m

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Specific Electrical conductivity

90 % IACS

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Chemical properties



5E-4 %

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99.9 %

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5E-3 %

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0.01 %

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