EN 1652 Grade CuZn0.5 R290

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CuZn0,5, mat. No CW119C, is counted among unhardenable, low alloyed copper alloys. To the comparable make CuZn0,5, mat. No 2.0205, acc. to DIN 17666 : 1983-12 applies: A strength increase is achievable only by cold forming. According to the deformation level the tensile strength is between 220 and 360 N/mm². Temperature for removal of workhardening is above 250°C. Electrical conductivity is very high. Corrosion resistance is equal to unalloyed copper. Processing properties: hot forming: good cold forming: very good machinability: moderately soft and hard soldering: very good gas shielded welding: very good burnishing: good Application: For strips, construction parts and all types of hollow-ware as well as for heat transmission elements. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)

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This material data has been provided by WIAM.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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20.0 °C

8.9 - 8.92 g/cm³

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Elastic modulus

20.0 °C

127 GPa

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20.0 °C

6 %

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Poisson's ratio

20.0 °C

0.34 [-]

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Shear modulus

23.0 °C

48 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper

Tensile strength

20.0 °C

290 - 360 MPa

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Yield strength Rp0.2

20.0 °C

250 MPa

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Coefficient of thermal expansion

300.0 °C

1.77E-5 1/K

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Melting point

965 - 1100 °C

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Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

20.0 °C

386 J/(kg·K)

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100.0 °C

395 J/(kg·K)

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200.0 °C

407 J/(kg·K)

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Thermal conductivity

20.0 °C

350 W/(m·K)

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Electrical conductivity

20.0 °C

4.80E+7 S/m

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Specific Electrical conductivity

83 % IACS

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Chemical properties



0.02 %

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0.1 - 1 %

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