EN 1652 Grade CuNi25 R290

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Description

CuNi25 is comparable to CuNi25, mat. no. 2.0830, acc. to DIN 17664 : 1983-12. To the comparable DIN-mark applies: The material shows favorable specific strength values also at endurance loading and increased temperatures. Thermal conductivity of pure copper is strongly reduced by Ni, the electrical resistance strongly increases according to the Ni-content. CuNi25 is corrosion and wear resistant. warm forming: good cold forming: good machinability: moderately hard soldering: very good soft soldering: very good gas-shielded welding: very good burnishing: very good Application: Preferred alloy for coins due to its silver-white color, brilliance, tarnish resistance and favorable wear resistance. Further application as cladding material.

Related Standards

Equivalent Materials

This material data has been provided by WIAM.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.9 g/cm³

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Mechanical

PropertyTemperatureValue

Elastic modulus

20.0 °C

145 GPa

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Tensile strength

20.0 °C

290 MPa

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Yield strength Rp0.2

20.0 °C

100 MPa

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Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

300.0 °C

1.55E-5 1/K

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Melting point

915 - 1240 °C

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Typical for Wrought Copper Nickel Grade

Specific heat capacity

23.0 °C

375 - 398 J/(kg·K)

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Typical for Wrought Copper Nickel Grade

Thermal conductivity

20.0 °C

29 W/(m·K)

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Chemical properties

PropertyValue

Carbon

0.05 %

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Cobalt

0.1 %

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Iron

0.3 %

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Lead

0.02 %

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Manganese

0.5 %

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Nickel

24 - 26 %

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Sulfur

0.05 %

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Tin

0.03 %

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Zinc

0.5 %

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