EN 1652 Grade CuNi25 R290

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Description

CuNi25 is comparable to CuNi25, mat. no. 2.0830, acc. to DIN 17664 : 1983-12. To the comparable DIN-mark applies: The material shows favorable specific strength values also at endurance loading and increased temperatures. Thermal conductivity of pure copper is strongly reduced by Ni, the electrical resistance strongly increases according to the Ni-content. CuNi25 is corrosion and wear resistant. warm forming: good cold forming: good machinability: moderately hard soldering: very good soft soldering: very good gas-shielded welding: very good burnishing: very good Application: Preferred alloy for coins due to its silver-white color, brilliance, tarnish resistance and favorable wear resistance. Further application as cladding material.

Related Standards

Equivalent Materials

This material data has been provided by WIAM.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

Property	Temperature	Value
Density	20.0 °C	8.9 g/cm³ Show Material materials with Density of 8.9 g/cm³

Mechanical

Property	Temperature	Value
Elastic modulus	20.0 °C	145 GPa Show Material materials with Elastic modulus of 145 GPa
Tensile strength	20.0 °C	290 MPa Show Material materials with Tensile strength of 290 MPa
Yield strength Rp0.2	20.0 °C	100 MPa Show Material materials with Yield strength Rp0.2 of 100 MPa

Thermal

Property	Temperature	Value	Comment
Coefficient of thermal expansion	300.0 °C	1.55E-5 1/K Show Material materials with Coefficient of thermal expansion of 1.55E-5 1/K
Melting point		915 - 1240 °C Show Material materials with Melting point of 915 - 1240 °C	Typical for Wrought Copper Nickel Grade
Specific heat capacity	23.0 °C	375 - 398 J/(kg·K) Show Material materials with Specific heat capacity of 375 - 398 J/(kg·K)	Typical for Wrought Copper Nickel Grade
Thermal conductivity	20.0 °C	29 W/(m·K) Show Material materials with Thermal conductivity of 29 W/(m·K)

Chemical properties

Property	Value
Carbon	0.05 % Show Material materials with Carbon of 0.05 %
Cobalt	0.1 % Show Material materials with Cobalt of 0.1 %
Iron	0.3 % Show Material materials with Iron of 0.3 %
Lead	0.02 % Show Material materials with Lead of 0.02 %
Manganese	0.5 % Show Material materials with Manganese of 0.5 %
Nickel	24 - 26 % Show Material materials with Nickel of 24 - 26 %
Sulfur	0.05 % Show Material materials with Sulfur of 0.05 %
Tin	0.03 % Show Material materials with Tin of 0.03 %
Zinc	0.5 % Show Material materials with Zinc of 0.5 %