EN 1652 Grade CuNi25 H070

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CuNi25 is comparable to CuNi25, mat. no. 2.0830, acc. to DIN 17664 : 1983-12. To the comparable DIN-mark applies: The material shows favorable specific strength values also at endurance loading and increased temperatures. Thermal conductivity of pure copper is strongly reduced by Ni, the electrical resistance strongly increases according to the Ni-content. CuNi25 is corrosion and wear resistant. warm forming: good cold forming: good machinability: moderately hard soldering: very good soft soldering: very good gas-shielded welding: very good burnishing: very good Application: Preferred alloy for coins due to its silver-white color, brilliance, tarnish resistance and favorable wear resistance. Further application as cladding material.

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Equivalent Materials

This material data has been provided by WIAM.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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20.0 °C

8.9 g/cm³

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Elastic modulus

20.0 °C

145 GPa

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Hardness, Vickers

20.0 °C

70 - 100 [-]

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Coefficient of thermal expansion

300.0 °C

1.55E-5 1/K

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Melting point

915 - 1240 °C

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Typical for Wrought Copper Nickel Grade

Specific heat capacity

23.0 °C

375 - 398 J/(kg·K)

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Typical for Wrought Copper Nickel Grade

Thermal conductivity

20.0 °C

29 W/(m·K)

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Chemical properties



0.05 %

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0.1 %

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0.3 %

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0.02 %

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0.5 %

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24 - 26 %

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0.05 %

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0.03 %

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0.5 %

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