EN 1652 Grade CuNi9Sn2 R560

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Description

CuNi9Sn2 (CW351H) is comparable to CuNi9Sn2, mat. no. 2.0875, acc. to DIN 17664 : 1983-12. To the comparable DIN-mark applies: The material shows high strength specific values as well as favorable tarnish-proofness and a very good stress relaxation behaviour in spring-hard condition. CuNi9Sn2 has sufficient electrical and thermal conductivity. Favorable corrosion resistance in natural resp. industrial atmosphere. Also resistance to different waters, humidity, non-oxidizing acids, bases and saline solutions. No risk of stress corrosion. Processing properties: warm forming: good cold forming: very good machinability: unfavorable hard soldering: very good soft soldering: very good gas-shielded welding: very good burnishing: very good Application: For elastic components in relay, pushbutton switchers, connectors and receptacles in communications engineering, in EDP-systems, in consumer electronics equipment and in automobile electronics, for switcher components, soldering tags and frames, boxes for electrical components, carrier plates for integrated circuits an for conductor board pens. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)

Related Standards

Equivalent Materials

This material data has been provided by WIAM.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.89 - 8.9 g/cm³

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Mechanical

PropertyTemperatureValue

Elastic modulus

20.0 °C

140 GPa

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Elongation A50

20.0 °C

2 %

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Poisson's ratio

20.0 °C

0.34 [-]

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Tensile strength

20.0 °C

560 - 650 MPa

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Yield strength Rp0.2

20.0 °C

520 MPa

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Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

100.0 °C

1.55E-5 1/K

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200.0 °C

1.59E-5 1/K

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300.0 °C

1.66E-5 1/K

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Melting point

915 - 1240 °C

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Typical for Wrought Copper Nickel Grade

Specific heat capacity

20.0 °C

370 J/(kg·K)

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100.0 °C

390 J/(kg·K)

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200.0 °C

410 J/(kg·K)

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Thermal conductivity

20.0 °C

48 W/(m·K)

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100.0 °C

56 W/(m·K)

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200.0 °C

65 W/(m·K)

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Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

6.00E+6 - 6.40E+6 S/m

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Specific Electrical conductivity

10 - 11 % IACS

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Chemical properties

PropertyValue

Iron

0.3 %

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Lead

0.03 %

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Manganese

0.3 %

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Nickel

8.5 - 10.5 %

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Tin

1.8 - 2.8 %

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Zinc

0.05 - 0.1 %

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