EN 1653 Grade Cu-DLP R200

Want to keep this datasheet? Save it now in your required format

Description

Copper plates, sheet and circles for boilers, pressure vessels and hot water storage units.

Related Standards

Equivalent Materials

This material data has been provided by WIAM.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts

See where falls on the material property chart for against in your materials selection and design process. Our Ashby charts are interactive with more technical data upon clicking. Sign up to get access to this premium feature for free.

Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.9 - 8.94 g/cm³

Show Material materials with Density of 8.9 - 8.94 g/cm³

Mechanical

PropertyTemperatureValueComment

Elastic modulus

20.0 °C

129 - 132 GPa

Show Material materials with Elastic modulus of 129 - 132 GPa

Elongation

20.0 °C

33 - 42 %

Show Material materials with Elongation of 33 - 42 %

Hardness, Vickers

20.0 °C

55 [-]

Show Material materials with Hardness, Vickers of 55 [-]

Poisson's ratio

20.0 °C

0.34 [-]

Show Material materials with Poisson's ratio of 0.34 [-]

Shear modulus

23.0 °C

48 GPa

Show Material materials with Shear modulus of 48 GPa

Typical for Wrought Copper Pure / Low Alloyed Copper

Tensile strength

20.0 °C

200 - 250 MPa

Show Material materials with Tensile strength of 200 - 250 MPa

Yield strength Rp0.2

20.0 °C

40 - 100 MPa

Show Material materials with Yield strength Rp0.2 of 40 - 100 MPa

Yield strength Rp1.0

50.0 °C

60 MPa

Show Material materials with Yield strength Rp1.0 of 60 MPa

100.0 °C

55 MPa

Show Material materials with Yield strength Rp1.0 of 55 MPa

150.0 °C

55 MPa

Show Material materials with Yield strength Rp1.0 of 55 MPa

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.6E-5 - 1.8E-5 1/K

Show Material materials with Coefficient of thermal expansion of 1.6E-5 - 1.8E-5 1/K

Typical for Wrought Copper Pure / Low Alloyed Copper

Melting point

965 - 1100 °C

Show Material materials with Melting point of 965 - 1100 °C

Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

20.0 °C

385 - 386 J/(kg·K)

Show Material materials with Specific heat capacity of 385 - 386 J/(kg·K)

Thermal conductivity

20.0 °C

350 - 352 W/(m·K)

Show Material materials with Thermal conductivity of 350 - 352 W/(m·K)

Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

5.20E+7 S/m

Show Material materials with Electrical conductivity of 5.20E+7 S/m

Electrical resistivity

20.0 °C

1.9E-8 Ω·m

Show Material materials with Electrical resistivity of 1.9E-8 Ω·m

Chemical properties

PropertyValue

Bismuth

5E-4 %

Show Material materials with Bismuth of 5E-4 %

Copper

99.9 %

Show Material materials with Copper of 99.9 %

Lead

5E-3 %

Show Material materials with Lead of 5E-3 %

Phosphorus

0.01 %

Show Material materials with Phosphorus of 0.01 %