EN 12163 Grade CuZn31Si1 H115

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Description

CuZn31Si1 (CW708R) is an unhardenable copper alloy. High hardness and strength parameter are achievable by cold forming only. Silicon decreases stress corrosion sensitivity. CuZn31Si1 shows favorable friction qualities. Processing properties: warm forming: moderately cold forming: good machinability: moderately hard soldering: moderately soft soldering: moderately TIG-welding: good burnishing: very good Appliction in machine, apparatus and plant construction particularly as friction elements such as bearing bushings, guidances etc.

Related Standards

Equivalent Materials

This material data has been provided by WIAM.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.4 - 8.41 g/cm³

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Mechanical

PropertyTemperatureValueComment

Elastic modulus

20.0 °C

108 GPa

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Hardness, Brinell

20.0 °C

110 - 150 [-]

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Hardness, Vickers

20.0 °C

115 - 155 [-]

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Shear modulus

23.0 °C

40 GPa

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Typical for Wrought Copper Brass

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

200.0 °C

1.92E-5 1/K

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Melting point

875 - 1075 °C

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Typical for Wrought Copper Brass

Specific heat capacity

20.0 °C

394 J/(kg·K)

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100.0 °C

403 J/(kg·K)

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200.0 °C

415 J/(kg·K)

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Thermal conductivity

20.0 °C

71 W/(m·K)

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100.0 °C

79 W/(m·K)

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200.0 °C

86 W/(m·K)

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Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

8.90E+6 S/m

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Specific Electrical conductivity

15 % IACS

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Chemical properties

PropertyValue

Copper

66 - 70 %

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Iron

0.4 %

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Lead

0.8 %

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Nickel

0.5 %

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Silicon

0.7 - 1.3 %

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