EN 12163 Grade CuNi30Mn1Fe M

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CuNi30Mn1Fe (CW354H) is comparable to CuNi30Mn1Fe, mat. no. 2.0882, acc. to DIN 17664 : 1983-12. To the comparable DIN-mark applies: The material shows favorable specific strength values also at endurance loading and increased temperatures. Thermal conductivity of pure copper is strongly reduced by Ni, the electrical resistance strongly increases according to the Ni-content. Fe-addition increases the corrosion resistance. CuNi30Mn1Fe is resistant to water and seawater, coolant and solvent, alkaline substances, alkaline saline solutions and non-oxidizing acids. warm forming: good cold forming: good machinability: moderately hard soldering: very good soft soldering: very good gas-shielded welding: very good burnishing: good Application: For seawater pipilines, tubes and plates for all types of tubular heat-exchanger (condenser, cooler, seawater evaporators, high pressure feeder water heater) on ships, in power plants, in petroleum processing an in chemical factories as well as in saltern plants. The material is established for condenser in ammoniac steam.

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This material data has been provided by WIAM.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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20.0 °C

8.9 g/cm³

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Elastic modulus

23.0 °C

120 - 156 GPa

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Typical for Wrought Copper Nickel Grade



Coefficient of thermal expansion

23.0 °C

1.4E-5 - 1.8E-5 1/K

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Typical for Wrought Copper Nickel Grade

Melting point

915 - 1240 °C

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Typical for Wrought Copper Nickel Grade

Specific heat capacity

23.0 °C

375 - 398 J/(kg·K)

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Typical for Wrought Copper Nickel Grade

Thermal conductivity

23.0 °C

21 - 195 W/(m·K)

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Typical for Wrought Copper Nickel Grade

Chemical properties



0.05 %

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0.1 %

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0.4 - 1 %

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0.02 %

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0.5 - 1.5 %

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30 - 32 %

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0.02 %

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0.05 %

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0.05 %

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0.5 %

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