EN 12164 Grade CuPb1P M

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Description

CuPb1P, mat. No CW113C, is counted among unhardenable, low alloyed copper alloys. To the comparable make CuPb1P, mat. No 2.1160, acc. to DIN 17666 : 1983-12 applies: A strength increase is achievable only by cold forming. The material shows a very high electrical and thermal conductivity as well as very good machinability and cold formability Application: For turning parts for sanitary installations, welding torch nozzles, screws and nuts. Due to the high electrical conductivity for diode plates as well as for electrical connecting and contact elements.

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Equivalent Materials

This material data has been provided by WIAM.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.9 g/cm³

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Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

110 - 130 GPa

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Typical for Wrought Copper High Copper Alloy

Elongation A10

20.0 °C

6 %

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Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.6E-5 - 1.8E-5 1/K

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Typical for Wrought Copper High Copper Alloy

Melting point

855 - 1090 °C

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Typical for Wrought Copper High Copper Alloy

Specific heat capacity

23.0 °C

360 - 420 J/(kg·K)

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Typical for Wrought Copper High Copper Alloy

Chemical properties

PropertyValue

Lead

0.7 - 1.5 %

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Phosphorus

0 - 0.01 %

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