EN 12164 Grade CuPb1P R250

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Description

CuPb1P, mat. No CW113C, is counted among unhardenable, low alloyed copper alloys. To the comparable make CuPb1P, mat. No 2.1160, acc. to DIN 17666 : 1983-12 applies: A strength increase is achievable only by cold forming. The material shows a very high electrical and thermal conductivity as well as very good machinability and cold formability Application: For turning parts for sanitary installations, welding torch nozzles, screws and nuts. Due to the high electrical conductivity for diode plates as well as for electrical connecting and contact elements.

Related Standards

Equivalent Materials

This material data has been provided by WIAM.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.9 g/cm³

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Mechanical

PropertyTemperatureValue

Elastic modulus

20.0 °C

115 GPa

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Elongation

20.0 °C

7 %

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Elongation A10

20.0 °C

5 %

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Elongation A100

20.0 °C

3 %

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Elongation A11.3

20.0 °C

5 %

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Hardness, Brinell

20.0 °C

80 - 110 [-]

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Tensile strength

20.0 °C

250 MPa

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Yield strength Rp0.2

20.0 °C

180 - 200 MPa

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Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.6E-5 - 1.8E-5 1/K

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Typical for Wrought Copper High Copper Alloy

Melting point

855 - 1090 °C

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Typical for Wrought Copper High Copper Alloy

Specific heat capacity

23.0 °C

360 - 420 J/(kg·K)

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Typical for Wrought Copper High Copper Alloy

Thermal conductivity

20.0 °C

350 W/(m·K)

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Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

5.00E+7 S/m

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Specific Electrical conductivity

86 % IACS

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Chemical properties

PropertyValue

Lead

0.7 - 1.5 %

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Phosphorus

0 - 0.01 %

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