EN 12164 Grade CuPb1P R250

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CuPb1P, mat. No CW113C, is counted among unhardenable, low alloyed copper alloys. To the comparable make CuPb1P, mat. No 2.1160, acc. to DIN 17666 : 1983-12 applies: A strength increase is achievable only by cold forming. The material shows a very high electrical and thermal conductivity as well as very good machinability and cold formability Application: For turning parts for sanitary installations, welding torch nozzles, screws and nuts. Due to the high electrical conductivity for diode plates as well as for electrical connecting and contact elements.

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Equivalent Materials

This material data has been provided by WIAM.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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20.0 °C

8.9 g/cm³

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Elastic modulus

20.0 °C

115 GPa

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20.0 °C

7 %

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Elongation A10

20.0 °C

5 %

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Elongation A100

20.0 °C

3 %

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Elongation A11.3

20.0 °C

5 %

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Hardness, Brinell

20.0 °C

80 - 110 [-]

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Tensile strength

20.0 °C

250 MPa

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Yield strength Rp0.2

20.0 °C

180 - 200 MPa

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Coefficient of thermal expansion

23.0 °C

1.6E-5 - 1.8E-5 1/K

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Typical for Wrought Copper High Copper Alloy

Melting point

855 - 1090 °C

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Typical for Wrought Copper High Copper Alloy

Specific heat capacity

23.0 °C

360 - 420 J/(kg·K)

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Typical for Wrought Copper High Copper Alloy

Thermal conductivity

20.0 °C

350 W/(m·K)

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Electrical conductivity

20.0 °C

5.00E+7 S/m

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Specific Electrical conductivity

86 % IACS

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Chemical properties



0.7 - 1.5 %

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0 - 0.01 %

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