EN 12164 Grade CuTeP M

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CuTeP, mat. No CW118C, is counted among unhardenable, low alloyed copper alloys. To the comparable make CuTeP, mat. No 2.1546, acc. to DIN 17666 : 1983-12 applies: A strength increase is achievable only by cold forming. CuTeP is applicated as free-cutting alloy due to its favorable machinability. The alloy shows a higher temperature for removal of workhardening (350°C) compared to pure copper. CuTeP shows roughly the same electrical conductivity and corrosion resistance as copper. Processing properties: hot forming: very good cold forming: good machinability: very good soft and hard soldering: good gas shielded welding: good burnishing: good Application: In electronics and electrical engineering, e.g. for small parts such as diode bases and transistors. For welding torch nozzles, screws, nuts, parts for screw connections and fitting components.

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This material data has been provided by WIAM.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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20.0 °C

8.9 g/cm³

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Elastic modulus

23.0 °C

95 - 98 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper

Poisson's ratio

23.0 °C

0.34 [-]

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Typical for Wrought Copper Pure / Low Alloyed Copper

Shear modulus

23.0 °C

48 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper



Coefficient of thermal expansion

23.0 °C

1.6E-5 - 1.8E-5 1/K

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Typical for Wrought Copper Pure / Low Alloyed Copper

Melting point

965 - 1100 °C

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Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

23.0 °C

377 - 420 J/(kg·K)

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Typical for Wrought Copper Pure / Low Alloyed Copper

Chemical properties



0 - 0.01 %

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0.4 - 0.7 %

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