EN 12166 Grade CuNi1Si H160

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Equivalent Materials

This material data has been provided by WIAM.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts

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20.0 °C

8.8 - 8.9 g/cm³

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Elastic modulus

23.0 °C

110 - 130 GPa

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Typical for Wrought Copper High Copper Alloy

Hardness, Brinell

20.0 °C

160 - 210 [-]

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Coefficient of thermal expansion

300.0 °C

1.68E-5 1/K

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Melting point

855 - 1090 °C

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Typical for Wrought Copper High Copper Alloy

Specific heat capacity

20.0 °C

377 J/(kg·K)

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Electrical conductivity

20.0 °C

2.20E+7 S/m

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Specific Electrical conductivity

38 % IACS

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Chemical properties



0.2 %

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0.02 %

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0.1 %

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1 - 1.6 %

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0.4 - 0.7 %

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