EN 12166 Grade CuTeP H090

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CuTeP, mat. No CW118C, is counted among unhardenable, low alloyed copper alloys. To the comparable make CuTeP, mat. No 2.1546, acc. to DIN 17666 : 1983-12 applies: A strength increase is achievable only by cold forming. CuTeP is applicated as free-cutting alloy due to its favorable machinability. The alloy shows a higher temperature for removal of workhardening (350°C) compared to pure copper. CuTeP shows roughly the same electrical conductivity and corrosion resistance as copper. Processing properties: hot forming: very good cold forming: good machinability: very good soft and hard soldering: good gas shielded welding: good burnishing: good Application: In electronics and electrical engineering, e.g. for small parts such as diode bases and transistors. For welding torch nozzles, screws, nuts, parts for screw connections and fitting components.

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Equivalent Materials

This material data has been provided by WIAM.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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20.0 °C

8.8 - 8.9 g/cm³

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Elastic modulus

20.0 °C

120 GPa

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Hardness, Vickers

20.0 °C

90 - 130 [-]

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Poisson's ratio

23.0 °C

0.34 [-]

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Typical for Wrought Copper Pure / Low Alloyed Copper

Shear modulus

23.0 °C

48 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper



Coefficient of thermal expansion

300.0 °C

1.8E-5 1/K

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Melting point

965 - 1100 °C

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Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

23.0 °C

377 - 420 J/(kg·K)

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Typical for Wrought Copper Pure / Low Alloyed Copper

Thermal conductivity

20.0 °C

368 W/(m·K)

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Electrical conductivity

20.0 °C

5.45E+7 S/m

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Chemical properties



0 - 0.01 %

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0.4 - 0.7 %

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