EN 12166 Grade CuNi12Zn30Pb1 H02

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Material CuNi12Zn30Pb1, mat. No. CW406J is an alloy of high strength and hardness. To the comparabel mark CuNi12Zn30Pb1, mat. No. 2.0780, acc. to DIN 17663 : 1983-12 applies: Strength is further increasable due to the high strain hardening capability. The material does not embrittle at low temperatures. Low electrical and thermal conductivity. The alloy is non-magnetic, corrosion resistance is better than for pure copper. Machinability improves by Pb-addition, ductility decreases and cold workabiliy deteriorates. Processing properties: warm forming: unfavorable cold forming: moderately machinability: good hard and soft soldering: very good TIG-welding: moderately burnishing: good Application: Particularly in precision engineering and in toolbuilding for turning and drilling parts, in electrical engineering and electronics as well as in shipbuilding and in construction trade.

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Equivalent Materials

This material data has been provided by WIAM.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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23.0 °C

8.4 - 8.9 g/cm³

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Typical for Wrought Copper Nickel Silver Grade



Elastic modulus

23.0 °C

120 - 140 GPa

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Typical for Wrought Copper Nickel Silver Grade


20.0 °C

12 %

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Elongation A10

20.0 °C

10 %

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Elongation A100

20.0 °C

8 %

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Hardness, Vickers

20.0 °C

110 - 150 [-]

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Poisson's ratio

23.0 °C

0.32 [-]

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Typical for Wrought Copper Nickel Silver Grade

Tensile strength

20.0 °C

410 MPa

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Yield strength Rp0.2

20.0 °C

300 MPa

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Coefficient of thermal expansion

23.0 °C

1.6E-5 - 1.9E-5 1/K

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Typical for Wrought Copper Nickel Silver Grade

Melting point

875 - 1135 °C

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Specific heat capacity

23.0 °C

377 J/(kg·K)

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Thermal conductivity

23.0 °C

21 - 116 W/(m·K)

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Typical for Wrought Copper Nickel Silver Grade

Chemical properties



56 - 58 %

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0.3 %

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0.5 - 1.5 %

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0.5 %

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11 - 13 %

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0.2 %

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