EN 12167 Grade CuNi1Si H120

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Description

CuNi1Si, mat. No CW109C, is counted among hardenable, low alloyed copper alloys. To the comparable DIN-make CuNi1,5Si, mat. No 2.0853, acc. to DIN 17666 : 1983-12 applies: The material shows favorable electrical and thermal conductivity, corrosion resistance, high fatigue and creep resistance as well as favorable spring properties. CuNi1Si is in hardened condition resistant to stress corrosion. Temperature for removal of workhardening approximates 450°C. Strength still increases at low-temperature range. Processing properties: hot and cold forming: good machinability: moderately soft soldering: good hard soldering: moderately gas shielded welding: moderately burnishing: good Application: Particularly for aerial line material, such as clamps, mounting links, nuts, high-strength and corrosion resistant screws. Furthermore for wire ropes in electrical overhead line construction, bearing bushings, roller bearing cages, valve guide bushings and springs.

Related Standards

Equivalent Materials

This material data has been provided by WIAM.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.8 - 8.9 g/cm³

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Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

110 - 130 GPa

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Typical for Wrought Copper High Copper Alloy

Hardness, Brinell

20.0 °C

120 - 180 [-]

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Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

300.0 °C

1.68E-5 1/K

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Melting point

855 - 1090 °C

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Typical for Wrought Copper High Copper Alloy

Specific heat capacity

20.0 °C

377 J/(kg·K)

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Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

2.20E+7 S/m

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Specific Electrical conductivity

38 % IACS

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Chemical properties

PropertyValue

Iron

0.2 %

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Lead

0.02 %

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Manganese

0.1 %

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Nickel

1 - 1.6 %

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Silicon

0.4 - 0.7 %

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