UNS C10300 H55

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Equivalent Materials

This material data has been provided by MakeItFrom.com.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

23.0 °C

9 g/cm³

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Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

120 GPa

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Poisson's ratio

23.0 °C

0.34 [-]

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Typical for Wrought Copper Pure / Low Alloyed Copper

Shear modulus

23.0 °C

48 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper

Tensile strength

23.0 °C

290 MPa

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Yield strength

23.0 °C

240 MPa

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Thermal

PropertyTemperatureValue

Coefficient of thermal expansion

23.0 °C

1.6E-5 1/K

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Melting point

1080 °C

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Specific heat capacity

23.0 °C

390 J/(kg·K)

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Thermal conductivity

23.0 °C

390 W/(m·K)

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Chemical properties

PropertyValue

Copper

99.95 - 100 %

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Phosphorus

1E-3 - 5E-3 %

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