Properties
General
| Property | Temperature | Value | Comment |
|---|---|---|---|
Density | 23.0 °C | 4.72 g/cm³ Show Supplier Material materials with Density of 4.72 g/cm³ | For ceramic structural parts |
Mechanical
| Property | Temperature | Value | Comment |
|---|---|---|---|
Flexural strength | 23.0 °C | 200 MPa Show Supplier Material materials with Flexural strength of 200 MPa | For ceramic structural parts |
Thermal
| Property | Temperature | Value | Comment |
|---|---|---|---|
Coefficient of thermal expansion | 23.0 °C | 6.2E-6 1/K Show Supplier Material materials with Coefficient of thermal expansion of 6.2E-6 1/K | For ceramic structural parts |
Melting point | 2254 °C Show Supplier Material materials with Melting point of 2254 °C | ||
Thermal conductivity | 23.0 °C | 47 W/(m·K) Show Supplier Material materials with Thermal conductivity of 47 W/(m·K) | For ceramic structural parts |
Electrical
| Property | Temperature | Value | Comment |
|---|---|---|---|
Electrical conductivity | 23.0 °C | 66500 S/m Show Supplier Material materials with Electrical conductivity of 66500 S/m | For ceramic structural parts |
Electrical resistivity | 23.0 °C | 1.5E-8 Ω·m Show Supplier Material materials with Electrical resistivity of 1.5E-8 Ω·m | For ceramic structural parts |
Technological properties
| Property | ||
|---|---|---|
| Application areas | Thermionic emission (cathode), Plasma source for plasma enhanced coating(PECVD), Vacuum electron beam welding machine, Electron beam surface reforming device, Electron beam lithography device, Transmission electron microscope, Scanning electron microscope, Surface analysis device, Radiotherapy devices | |
| Chemical composition | LaB6 (% min.) 99.9%, B(% min.) 31% - Impurities: Ce <120ppm, Fe <250ppm, Pr <150ppm, Si <100ppm, Nd <180ppm, Ca <90ppm, Sm <112ppm, C <300ppm, Y <250ppm, Mg <100ppm, Ti <100ppm | |
| Crystal structure | Polycrystalline | |