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With Plansee's tungsten and molybdenum, it is assured that transistors, thyristors and power diodes keep their cool. With the outstanding material purity, electrical conductivity and thermal conductivity of Plansee base plates, heat is reliably dissipated away from the active device.
Mechanical stress between the substrate and the semiconductor material may impair the functioning of the final product. The coefficient of thermal expansion of Plansee substrates is similar to that of the semiconductor material. Like this, an exceptionally long component lifetime can be ensured.
The PVD process is applied to coat the Plansee materials, which guarantees extremely homogeneous coatings and outstanding material purity. Therefore, reverse voltages between the substrate and the semiconductor can be avoided.
Following the coating process, the substrates are extraordinarily clean. To prevent contamination, they are individually packaged in a cleanroom environment to achieve particle-free substrates.
Plansee offers customized base plates. Tungsten and molybdenum base plates coated with ruthenium, nickel, chromium, silver, and gold can be ordered. These metals improve the electrical contact and provide optimum protection against oxidation.
Due to their excellent adherence, they provide an optimum compound between the semiconductor and the base plate.
Plansee uses physical vapour deposition (PVD) to apply its coatings which guarantees extraordinary material purity and coating homogeneity.
Alternatively, Plansee can also supply galvanically applied coatings.