ForTii® LDS85B

Alternative und Handelsbezeichungen
PPA-GF30
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Description

ForTii® is a breakthrough high temperature polyamide with halogen-free and halogen containing flame retardant grades for demanding applications in the electronics, lighting, automotive, white goods, industrial and aerospace industries.
We developed ForTii® in close co-operation with leading OEMs and tier 1 connector and socket manufacturers to ensure we give our customer what they want – and need.
That means a high temperature polyamide with a broad and versatile portfolio of grades that deliver high performance with a unique balance of properties.

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ForTii® LDS85B

Diese Materialdaten wurden von DSM zur Verfügung gestellt

Alle Daten beziehen sich auf Raumtemperatur soweit nicht anderweitig spezifiziert. SI Einheiten werden verwendt soweit nicht anderweitig spezifiziert.
Äquivalente Standards sind ähnlich zu einem oder mehreren Standards die der Anbieter angegeben hat. Manche äquivalente Standards können strikter sein oder außerhalb der Bedingungen des ursprünglichen Standards.

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Eigenschaften

Allgemein

PropertyValueConditionTesting StandardComment

Dichte

1.51 g/cm³

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dry

ISO 1183

Moisture absorption

1.4 %

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dry

Sim. to ISO 62

Wasserabsorption

0.28 %

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dry

ISO 62

at 23°C after 24h

3.5 %

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dry

Sim. to ISO 62

Mechanisch

PropertyTemperatureValueConditionTesting StandardThicknessComment

Biegemodul

9.4 GPa

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dry

ISO 178

9.6 GPa

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conditioned

ISO 178

120 °C

5.4 GPa

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dry

ISO 178

160 °C

3.1 GPa

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dry

ISO 178

Dehnung

2.1 %

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dry, conditioned

ISO 527-1/-2

2.1 %

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conditioned

ISO 527-1/-2

2.2 %

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dry

ISO 527-1/-2

1 mm

120 °C

4 %

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dry

ISO 527-1/-2

160 °C

6 %

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dry

ISO 527-1/-2

Elastizitätsmodul

10 GPa

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dry, conditioned

ISO 527-1/-2

10 GPa

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dry, conditioned

ISO 527-1/-2

1 mm

120 °C

5.6 GPa

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dry

ISO 527-1/-2

160 °C

3 GPa

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dry

ISO 527-1/-2

Flexural yield strength

165 MPa

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conditioned

ISO 178

185 MPa

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dry

ISO 178

120 °C

100 MPa

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dry

ISO 178

160 °C

70 MPa

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dry

ISO 178

Schlagfestigkeit, Charpy gekerbt

23 °C

3.6 kJ/m²

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conditioned

ISO 179/1eA

23 °C

4 kJ/m²

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dry

ISO 179/1eA

Schlagzähigkeit, Charpy ungekerbt

23 °C

35 kJ/m²

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dry, conditioned

ISO 179/1eU

Zugfestigkeit

105 MPa

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conditioned

ISO 527-1/-2

110 MPa

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conditioned

ISO 527-1/-2

at low thickness

125 MPa

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dry

ISO 527-1/-2

130 MPa

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dry

ISO 527-1/-2

1 mm

at low thickness

120 °C

64 MPa

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dry

ISO 527-1/-2

160 °C

45 MPa

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dry

ISO 527-1/-2

Thermisch

PropertyValueConditionTesting StandardPressureComment

Glasübergangstemperatur

125 °C

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dry

ISO 11357-1/-2

10°C/min

Koeffizient der thermischen Ausdehnung

1.8e-07 1/K

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dry

ISO 11359-1/-2

Parallel

6e-07 1/K

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dry

ISO 11359-1/-2

Normal

Schmelzpunkt

325 °C

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dry

ISO 11357-1/-3

10°C/min

Wärmeformbeständigkeitstemperatur

285 °C

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dry

ISO 75-1/-2

2 MPa

315 °C

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dry

ISO 75-1/-2

0.45 MPa

Elektrisch

PropertyValueConditionTesting StandardComment

Dielektrizitätskonstante

3.73 [-]

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dry

IEC 60250

5GHz

3.78 [-]

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dry

IEC 60250

1GHz

3.8 [-]

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conditioned

IEC 60250

5GHz

3.85 [-]

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conditioned

IEC 60250

1GHz

Verlustfaktor

140 [-]

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dry

IEC 60250

5GHz

160 [-]

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dry

IEC 60250

1GHz

170 [-]

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conditioned

IEC 60250

5GHz

190 [-]

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conditioned

IEC 60250

1GHz

Rheological Properties

PropertyValueConditionTesting StandardComment

Schrumpfung

0.33 %

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dry

ISO 294-4

Parallel

1.3 %

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dry

ISO 294-4

Normal

Spiral flow length

90

dry

-

1.0 mm 1000 bar

Technological properties

Property
Application areas

T10 LDS sockets

Certifications

Yellow Card Available

Fillers

30% Glass Fiber