Orgalloy® R60 ES NAT

Alternative and trade names
PA6
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Description

Orgalloy® R 60 ES NAT resin is a polyamide alloy especially designed for blown film extrusion. This natural grade dedicated to extrusion offers good barrier properties and chemical resistance to solvents and alcohols while exhibiting a low surface tension (easy release).

This material data has been provided by Arkema Technical Polymers.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyValueConditionTesting Standard

Density

1.03 g/cm³

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dry

ISO 1183

Moisture absorption

1.3 %

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Sim. to ISO 62

Water absorption

3.3 %

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Sim. to ISO 62

Mechanical

PropertyTemperatureValueConditionTesting StandardComment

Elastic modulus

1.9 GPa

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cond.

ISO 527-1/-2

Elongation

50 %

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cond.

ISO 527-1/-2

min. | nominal

530 %

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dry

ISO 527-3

Transverse

530 %

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dry

ISO 527-3

Elongation at yield

3.4 %

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cond.

ISO 527-1/-2

20 %

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dry

ISO 527-3

Elongation at yield, transverse

15 %

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dry

ISO 527-3

Hardness, Shore D

73 [-]

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dry

ISO 7619-1

15 seconds

Impact strength, Charpy notched

23 °C

9 kJ/m²

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cond.

ISO 179/1eA

Impact strength, Charpy unnotched

No Break at 23°C

cond.

ISO 179/1eU

Tear force

35 N

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ISO 6383-2

Transverse

40 N

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ISO 6383-2

Tensile strength

60 MPa

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dry

ISO 527-3

Transverse

80 MPa

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dry

ISO 527-3

Yield strength

33 MPa

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dry

ISO 527-3

Transverse

47 MPa

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cond.

ISO 527-1/-2

55 MPa

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dry

ISO 527-1/-2

Thermal

PropertyValueConditionTesting StandardPressureComment

Coefficient of thermal expansion

9.3e-05 1/K

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dry

ISO 11359-1/-2

0.000133 1/K

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dry

ISO 11359-1/-2

Transverse

Heat deflection temperature

75 °C

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dry

ISO 75-1/-2

2 MPa

130 °C

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dry

ISO 75-1/-2

0.45 MPa

Melting point

220 °C

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dry

ISO 11357-1/-3

10°C/min

Vicat softening temperature

134 °C

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ISO 306

50°C/h 50N

Flammability

At thickness 1.6 mm IEC 60695-11-10: HB, At thickness 3.2 mm IEC 60695-11-10: HB

Electrical

PropertyValueConditionTesting StandardFrequencyComment

Comparative tracking index

600 V

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cond.

IEC 60112

Dielectric constant

3 [-]

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cond.

IEC 60250

100Hz

3 [-]

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IEC 60250

1MHz

Dielectric strength

38 kV/mm

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cond., dry

IEC 60243-1

Dissipation factor

0.025 [-]

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cond.

IEC 60250

1MHz

0.062 [-]

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cond.

IEC 60250

100Hz

Surface resistivity

1e+15 Ω/sq

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cond.

IEC 60093

min.

Volume resistivity

1e+13 Ω·cm

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cond.

IEC 60093

min.

Rheological Properties

PropertyValueConditionTesting StandardComment

Melt volume-flow rate

2.5 cm³/10min

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dry

ISO 1133

235°C/2.16kg

Technological properties

Property
Application areas

Mold Release Film

Processing methods

Injection Molding:

  • Melt temperature (°C) ISO 294: 260
  • Mold temperature (°C) ISO 10724: 60
  • Injection velocity (mm/s) ISO 294: -
  • Pressure at hold (MPa) ISO 294: -

  • Film Extrusion:

  • Drying time (only necessary for bags opened for more than two hours): 4-8 hours at 80°C
  • Extrusion melt temperature (min-recommended-max): 250-260-270°C