Orgalloy® R60 ES NAT

Alternative and trade names
PA6
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Description

Orgalloy® R 60 ES NAT resin is a polyamide alloy especially designed for blown film extrusion. This natural grade dedicated to extrusion offers good barrier properties and chemical resistance to solvents and alcohols while exhibiting a low surface tension (easy release).

This material data has been provided by Arkema High Performance Polymers.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.03 g/cm³

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ISO 1183

Moisture absorption

23.0 °C

1.3 %

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Sim. to ISO 62

Water absorption

23.0 °C

3.3 %

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Sim. to ISO 62

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

1.95 GPa

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ISO 527-1/-2, Conditioned

Elongation

23.0 °C

530 %

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ISO 527-3

Elongation at yield

23.0 °C

20 %

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ISO 527-3

Elongation at yield, transverse

23.0 °C

15 %

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ISO 527-3

Elongation, transverse

23.0 °C

530 %

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ISO 527-3

Hardness, Shore D

23.0 °C

73 [-]

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ISO 7619-1, 15 seconds

Tear force

23.0 °C

40 N

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ISO 6383-2

Tear force, transverse

23.0 °C

35 N

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ISO 6383-2

Tensile strength

23.0 °C

80 MPa

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ISO 527-3

Tensile strength, transverse

23.0 °C

60 MPa

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ISO 527-3

Yield strength

23.0 °C

35 MPa

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ISO 527-3

Yield strength, transverse

23.0 °C

33 MPa

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ISO 527-3

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

9.3E-5 1/K

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ISO 11359-1/-2

Coefficient of thermal expansion, transverse

23.0 °C

1.33E-4 1/K

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ISO 11359-1/-2

Heat deflection temperature, 0.45 MPa

130 °C

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ISO 75-1/-2

Heat deflection temperature, 1.80 MPa

75 °C

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ISO 75-1/-2

Melting point

220 °C

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ISO 11357-1/-3, 10°C/min

Vicat softening temperature

134 °C

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ISO 306, 50°C/h 50N

Flammability

At thickness 1.6 mm IEC 60695-11-10: HB, At thickness 3.2 mm IEC 60695-11-10: HB

Electrical

PropertyTemperatureValueComment

Comparative tracking index

23.0 °C

600 V

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IEC 60112, Conditioned

Dielectric constant, 100Hz

23.0 °C

3 [-]

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IEC 60250, Conditioned

Dielectric constant, 1MHz

23.0 °C

3 [-]

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IEC 60250, Conditioned

Dielectric strength

23.0 °C

38 kV/mm

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IEC 60243-1

Dissipation factor, 100Hz

23.0 °C

0.06 [-]

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IEC 60250, Conditioned

Dissipation factor, 1MHz

23.0 °C

0.03 [-]

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IEC 60250, Conditioned

Volume resistivity

23.0 °C

1.00E+13 Ω·cm

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min., IEC 60093, Conditioned

Rheological Properties

PropertyValueComment

Melt volume-flow rate

2.5 cm³/10min

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ISO 1133, 235°C/2.16kg

Technological properties

Property
Application areas

Main applications:

  • Technical film for Sheet Molding Compound (SMC)

    or

    Mold Release Film

  • Other

    Packaging:

  • This grade is delivered dried in sealed packaging (800kg octabin) ready to be processed.

    Shelf life:

  • Two years from the date of delivery. For any use above this limit, please refer to our technical services.

  • Processing methods

    Injection Molding:

  • Melt temperature (°C) ISO 294: 260
  • Mold temperature (°C) ISO 10724: 60
  • Injection velocity (mm/s) ISO 294: -
  • Pressure at hold (MPa) ISO 294: -

  • Film Extrusion:

  • Drying time (only necessary for bags opened for more than two hours): 4-8 hours at 80°C
  • Extrusion melt temperature (min-recommended-max): 250-260-270°C