General
Property | Value | Testing Standard | Comment |
---|---|---|---|
Relative density | 3 [-] Show Supplier Material materials with Relative density of 3 [-] | Archimedes | min. |
Mechanical
Property | Value | Testing Standard | Comment |
---|---|---|---|
Elastic modulus | 310 GPa Show Supplier Material materials with Elastic modulus of 310 GPa | EN DIN 843-2 | min. | Ultrasonic |
Flexural strength | 230 MPa Show Supplier Material materials with Flexural strength of 230 MPa | EN DIN 843-1 | min. | 4-point bending 20/40 mm | spacing 46x4x3 mm specimen size | ground surface 20°C |
Hardness, Vickers, 1 | 2243 [-] Show Supplier Material materials with Hardness, Vickers, 1 of 2243 [-] | Fracture surface ground and polished | |
Plane-Strain Fracture Toughnes | 2.4 MPa·√m Show Supplier Material materials with Plane-Strain Fracture Toughnes of 2.4 MPa·√m | EN DIN 14425 | SEVNB 4-point bending 20/40 mm | Spacing 46x4x3 mm | Specimen size 20°C |
Poisson's ratio | 0.15 [-] Show Supplier Material materials with Poisson's ratio of 0.15 [-] | EN DIN 843-2 | |
Weibull modulus | 15 [-] Show Supplier Material materials with Weibull modulus of 15 [-] | 4P | min. |
Thermal
Property | Temperature | Value | Testing Standard | Comment |
---|---|---|---|---|
Coefficient of thermal expansion | 3.7e-06 - 4.1e-06 1/K Show Supplier Material materials with Coefficient of thermal expansion of 3.7e-06 - 4.1e-06 1/K | 20-200°C | ||
3.9e-06 - 4.3e-06 1/K Show Supplier Material materials with Coefficient of thermal expansion of 3.9e-06 - 4.3e-06 1/K | 20-400°C | |||
4.2e-06 - 4.6e-06 1/K Show Supplier Material materials with Coefficient of thermal expansion of 4.2e-06 - 4.6e-06 1/K | 20-600°C | |||
4.5e-06 - 4.9e-06 1/K Show Supplier Material materials with Coefficient of thermal expansion of 4.5e-06 - 4.9e-06 1/K | 20-1000°C | |||
Specific heat capacity | 20 °C | 0.66 J/(kg·K) Show Supplier Material materials with Specific heat capacity of 0.66 J/(kg·K) | ISO 11357-1 | |
100 °C | 0.87 J/(kg·K) Show Supplier Material materials with Specific heat capacity of 0.87 J/(kg·K) | ISO 11357-1 | ||
Thermal conductivity | 140 W/(m·K) Show Supplier Material materials with Thermal conductivity of 140 W/(m·K) | DIN EN 821 | min. | Xe-flash sample | 16*16mm² material specific thickness |
Technological properties
Property | ||
---|---|---|
Other | Sintered silicon carbide is created when prepressed and very soft SiC granulate is sintered at a temperature of more than 2,000 °C, when very strong sintering bonds between the material grains are formed. Firstly, there is lattice densification, then the porosity is lowered, and finally, sintering bonds between the grains of SiC are formed. This firing process has considerable product shrinkage of about 20 %. The final material is single-phase with higher hardness, heat and chemical resistance than SiSiC. |