General
Property | Temperature | Value |
---|---|---|
Density | 23.0 °C | 8.81 g/cm³ Show Supplier Material materials with Density of 8.81 g/cm³ |
Dimension
Property | Value |
---|---|
Thickness | 0.05 - 2.03 mm Show Supplier Material materials with Thickness of 0.05 - 2.03 mm |
Width | 1.27 - 406.5 mm Show Supplier Material materials with Width of 1.27 - 406.5 mm |
Mechanical
Property | Temperature | Value |
---|---|---|
Bendability 90°, bw | 23.0 °C | 0.7 [-] Show Supplier Material materials with Bendability 90°, bw of 0.7 [-] |
Bendability 90°, gw | 23.0 °C | 0.7 [-] Show Supplier Material materials with Bendability 90°, gw of 0.7 [-] |
Elastic modulus | 23.0 °C | 135 GPa Show Supplier Material materials with Elastic modulus of 135 GPa |
Elongation | 23.0 °C | 11 % Show Supplier Material materials with Elongation of 11 % |
Tensile strength | 23.0 °C | 795 - 930 MPa Show Supplier Material materials with Tensile strength of 795 - 930 MPa |
Yield strength Rp0.2 | 23.0 °C | 655 - 795 MPa Show Supplier Material materials with Yield strength Rp0.2 of 655 - 795 MPa |
Thermal
Property | Temperature | Value |
---|---|---|
Coefficient of thermal expansion | 23.0 °C | 1.76E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 1.76E-5 1/K |
Thermal conductivity | 23.0 °C | 221 W/(m·K) Show Supplier Material materials with Thermal conductivity of 221 W/(m·K) |
Electrical
Property | Value | Comment |
---|---|---|
Specific Electrical conductivity | 50 % IACS Show Supplier Material materials with Specific Electrical conductivity of 50 % IACS | nominal value |
Chemical properties
Property | Value | Comment | |
---|---|---|---|
Beryllium | 0.15 - 0.5 % Show Supplier Material materials with Beryllium of 0.15 - 0.5 % | ||
Copper | Balance | ||
Nickel | 1 - 1.4 % Show Supplier Material materials with Nickel of 1 - 1.4 % | ||
Tin | 0.25 % Show Supplier Material materials with Tin of 0.25 % | max. | |
Zirconium | 0.5 % Show Supplier Material materials with Zirconium of 0.5 % | max. |
Technological properties
Property | ||
---|---|---|
Application areas | Brush 60 was performance engineered for electronic contact and spring applications in the computer, datacom and telecommunications markets. |