QMetᵀᴹ 200 Strip

Alternative and trade names
QMetᵀᴹ 200
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Description

Materion Performance Alloys’ QMet 200 strip is a high-performance, heat treated copper alloy designed to provide very high electrical and thermal conductivity while still retaining moderate strength. This non beryllium-containing alloy is idea for heat spreading structural components in consumer electronic devices as well as high reliability, high power electrical and electronic connectors.

This material data has been provided by Materion Brush GmbH.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

23.0 °C

8.81 g/cm³

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Dimension

PropertyValueComment

Thickness

0.15 - 0.8 mm

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gauge

Mechanical

PropertyTemperatureValueComment

Bendability 90°, bw

23.0 °C

0.5 [-]

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Bendability 90°, gw

23.0 °C

0.5 [-]

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Elastic modulus

23.0 °C

137 - 152 GPa

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Elongation

23.0 °C

5 - 10 %

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for strip thicker than 0.10 mm

Hardness, Vickers

23.0 °C

160 - 200 [-]

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Poisson's ratio

23.0 °C

0.3 [-]

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Tensile strength

23.0 °C

613 - 648 MPa

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Yield strength Rp0.2

23.0 °C

550 - 580 MPa

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Thermal

PropertyTemperatureValue

Coefficient of thermal expansion

23.0 °C

1.75E-5 1/K

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Thermal conductivity

23.0 °C

210 W/(m·K)

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Electrical

PropertyTemperatureValue

Electrical conductivity

23.0 °C

2.90E+7 S/m

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Specific Electrical conductivity

48 - 50 % IACS

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Chemical properties

PropertyValueComment

Chromium

0.5 - 3 %

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Ni+Si+Cr

Copper

99.5 %

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min.

Nickel

0.5 - 3 %

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Ni+Si+Cr

Silicon

0.5 - 3 %

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Ni+Si+Cr

Technological properties

Property
Application areas

Automotive Wire Harness Terminals and High Voltage Connectors, EV Charging Contacts, Appliance Power Contacts, Computer Power Contacts, Backplane, Midplane and Card Edge Connectors, Photovoltaic System Connectors, Heat Spreading for Consumer Electronics