EtchMetᵀᴹ (C17200) TD04 Wire

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Description

EtchMet alloy is a material that is tailor made for the springs in voice coil motors and optical image stabilization systems common in smart phone cameras. These devices have a relatively large mass (lense) suspended by extremely small, thin springs. The small size of the springs requires very high strength material to withstand shock loads when the phone is dropped or deliberately tapped against an NFC reader. Therefore, the springs must be made from a very robust material. Furthermore, the lack of a damping mechanism makes high spring stiffness important to combat vibration. EtchMet wire provides a number of advantages that make it the ideal material for this application:

It has a uniform elastic modulus across all thicknesses/diameters and from product form to product form. This provides consistent stiffness and damping behavior which makes spring calculations easy.

It has a very high resilience allowing it to withstand impact loads without fracturing or permanently deforming.

It has high fatigue strength to withstand many drops and actuation cycles.

It solders and welds readily.

Related Standards

ASTM B250

This material data has been provided by Materion Brush GmbH.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

Property	Temperature	Value
Density	23.0 °C	8.3 - 8.36 g/cm³ Show Supplier Material materials with Density of 8.3 - 8.36 g/cm³

Mechanical

Property	Temperature	Value	Comment
Elastic modulus	23.0 °C	131 GPa Show Supplier Material materials with Elastic modulus of 131 GPa
Elongation	23.0 °C	1 - 8 % Show Supplier Material materials with Elongation of 1 - 8 %	for wire with 0.1mm diameter and more.
Tensile strength	23.0 °C	960 - 1140 MPa Show Supplier Material materials with Tensile strength of 960 - 1140 MPa
Yield strength Rp0.2	23.0 °C	890 - 1110 MPa Show Supplier Material materials with Yield strength Rp0.2 of 890 - 1110 MPa

Thermal

Property	Temperature	Value
Coefficient of thermal expansion	23.0 °C	1.75E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 1.75E-5 1/K
Thermal conductivity	23.0 °C	105 W/(m·K) Show Supplier Material materials with Thermal conductivity of 105 W/(m·K)

Electrical

Property	Temperature	Value
Electrical resistivity	23.0 °C	6.2E-6 - 7.8E-6 Ω·m Show Supplier Material materials with Electrical resistivity of 6.2E-6 - 7.8E-6 Ω·m
Specific Electrical conductivity		22 - 28 % IACS Show Supplier Material materials with Specific Electrical conductivity of 22 - 28 % IACS

Magnetic

Property	Temperature	Value	Comment
Relative magnetic permeability	23.0 °C	1 [-] Show Supplier Material materials with Relative magnetic permeability of 1 [-]	max.

Chemical properties

Property	Value	Comment
Beryllium	1.8 - 2 % Show Supplier Material materials with Beryllium of 1.8 - 2 %
Cobalt	0.2 % Show Supplier Material materials with Cobalt of 0.2 %	min. Nickel + Cobalt
Copper	Balance
Iron	0.6 % Show Supplier Material materials with Iron of 0.6 %	max. Nickel + Cobalt + Iron
Nickel	0.2 % Show Supplier Material materials with Nickel of 0.2 %	min. Nickel + Cobalt

Technological properties

Property
Application areas	EtchMet alloy is a material that is tailor made for the springs in voice coil motors and optical image stabilization systems common in smart phone cameras.

EtchMetᵀᴹ (C17200) TD04 Wire

Description

Related Standards

Ashby charts

Applications

Materials by this supplier

Properties