EtchMetᵀᴹ (C17200) TD04 Wire

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Description

EtchMet alloy is a material that is tailor made for the springs in voice coil motors and optical image stabilization systems common in smart phone cameras. These devices have a relatively large mass (lense) suspended by extremely small, thin springs. The small size of the springs requires very high strength material to withstand shock loads when the phone is dropped or deliberately tapped against an NFC reader. Therefore, the springs must be made from a very robust material. Furthermore, the lack of a damping mechanism makes high spring stiffness important to combat vibration. EtchMet wire provides a number of advantages that make it the ideal material for this application:


  • It has a uniform elastic modulus across all thicknesses/diameters and from product form to product form. This provides consistent stiffness and damping behavior which makes spring calculations easy.
  • It has a very high resilience allowing it to withstand impact loads without fracturing or permanently deforming.
  • It has high fatigue strength to withstand many drops and actuation cycles.
  • It solders and welds readily.
  • Related Standards

    This material data has been provided by Materion Brush GmbH.

    All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
    Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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    Properties

    General

    PropertyTemperatureValue

    Density

    23.0 °C

    8.3 - 8.36 g/cm³

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    Mechanical

    PropertyTemperatureValueComment

    Elastic modulus

    23.0 °C

    131 GPa

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    Elongation

    23.0 °C

    1 - 8 %

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    for wire with 0.1mm diameter and more.

    Tensile strength

    23.0 °C

    960 - 1140 MPa

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    Yield strength Rp0.2

    23.0 °C

    890 - 1110 MPa

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    Thermal

    PropertyTemperatureValue

    Coefficient of thermal expansion

    23.0 °C

    1.75E-5 1/K

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    Thermal conductivity

    23.0 °C

    105 W/(m·K)

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    Electrical

    PropertyTemperatureValue

    Electrical resistivity

    23.0 °C

    6.2E-6 - 7.8E-6 Ω·m

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    Specific Electrical conductivity

    22 - 28 % IACS

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    Magnetic

    PropertyTemperatureValueComment

    Relative magnetic permeability

    23.0 °C

    1 [-]

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    max.

    Chemical properties

    PropertyValueComment

    Beryllium

    1.8 - 2 %

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    Cobalt

    0.2 %

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    min. Nickel + Cobalt

    Copper

    Balance

    Iron

    0.6 %

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    max. Nickel + Cobalt + Iron

    Nickel

    0.2 %

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    min. Nickel + Cobalt

    Technological properties

    Property
    Application areas

    EtchMet alloy is a material that is tailor made for the springs in voice coil motors and optical image stabilization systems common in smart phone cameras.